Electronics Forum: soldering alloy (Page 6 of 97)

Differences between solder paste alloy SAC305 and SAC405.

Electronics Forum | Wed Sep 29 19:47:44 EDT 2021 | emeto

"For the lead free soldering of electronic assemblies, the inclusion of silver in the alloy results in better wetting compared to non-silver containing alloys and also allows for a broader process window. Silver also improves joint reliab

Use lead-free alloy wire during rework for Leaded Process

Electronics Forum | Wed Nov 01 07:32:33 EST 2006 | davef

What you have run up against is the unfortunate consequence of the transition period from Sn-Pb to Pb-free. In the past 2-3 years there have been several studies highlighting the differences in reliability between mixed metal systems, Sn/Pb, and SAC

Re: What is the typical BGA substrate pad alloy

Electronics Forum | Wed Dec 08 17:58:44 EST 1999 | Dave F

Dave: You should see a solder smudge on the gold plating where the ball was attached, if there is (was) solder reflow during either the (1) BGA fabrication, (2) your BGA attach, and / or (3) your BGA removal. You rework will not remove the solder

Use lead-free alloy wire during rework for Leaded Process

Electronics Forum | Tue Nov 07 10:43:25 EST 2006 | muse95

Also, have you considered the possibility that if you solder on an existing joint on a board that was built with SnPb solder, even though you are using leadfree solder wire, you would now contaminate the tip of your soldering iron. If you then start

Re: What is the typical BGA substrate pad alloy

Electronics Forum | Fri Dec 03 18:17:12 EST 1999 | Dave F

Dave: There's lots of stuff on the web describing BGAs. Examples are: http://www.smtnet.com/bookstore/publications/0speckdo1/s1.html http://www.smtnet.com/bookstore/publications/0shutcco1/ch1p2.html http://www.citizen-america.com/OEM/bga/process

Re: What is the typical BGA substrate pad alloy

Electronics Forum | Wed Dec 08 10:10:41 EST 1999 | John Thorup

Hi Dave I think you just provided the key to understanding the problem. By your description you are talking about a CBGA (ceramic). These typically have balls composed of 10/90 Sn/Pb which melts at a higher temperature than the 62/36/2 Sn/Pb/Ag (or

Re: What is the typical BGA substrate pad alloy

Electronics Forum | Tue Dec 07 20:07:21 EST 1999 | Dave C.

Thanks for all the info Dave. It's the interconnect between the copper foil pad and the eutectic solder ball that I'm most interested in. The BGA in question is very thin gold plated over nickel over the copper. When we are reworking the BGA, i

Use lead-free alloy wire during rework for Leaded Process

Electronics Forum | Tue Oct 31 22:09:25 EST 2006 | davef

The is a serious concern of lead contamination of leadfree solder connections. For background, search the fine SMTnet Archives. For instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=30307

Use lead-free alloy wire during rework for Leaded Process

Electronics Forum | Tue Oct 31 19:41:38 EST 2006 | Dhanish

Can someone advise if there is any risk if we use lead-free alloy wire during rework for Leaded Process?The reason for this proposal is to only have one type of solder wire being used in the line.This will eliminate any possibility of leaded wire bei

Use lead-free alloy wire during rework for Leaded Process

Electronics Forum | Wed Nov 08 19:49:41 EST 2006 | davef

Dr. Brian Toleno wrote that section of the posting that I pasted onto the forum. Try: * �Lead-free Soldering Backward Compatibility�, Pan, et al., IPC/JEDEC Pb-free Conference, San Jose, 2006 * Checking with http://www.ipc.org * Contacting Jianbia


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