Electronics Forum | Tue Mar 09 18:21:37 EST 1999 | Stan Levitsky
We will wave solder a board with SOIC14 and SOIC16 parts on the bottom. It has been difficult to find any specific wave solder process recommendations from manufacturers of the SOICs. The pad geometry utilizes theiving pads on both sides to reduce br
Electronics Forum | Wed Aug 23 19:01:54 EDT 2000 | kbmacg
For high temperature electronics, operating in 225�C ambient environments, most solders can not be used. The high-lead solders all have difficulties of one sort or another. Is their anything new regarding useful high melting point solders? Especially
Electronics Forum | Fri Jan 27 15:12:48 EST 2006 | GS
From technical point of view: it should not be a problem to mix Pb with Pb Free components soldered with a LF solder process. You have to take care about the max temperature allowed on your Pb components and make sure they can withstand the higher
Electronics Forum | Thu Jan 24 19:58:58 EST 2002 | davef
for regular eutecticish solders, keep the pot temperature between 230�C [446�F] and 290�C [554�F]. If you polled us on our pot temperatures, we�d be all over the map, but with more lower than higher than you. High pot temperatures tend to generate
Electronics Forum | Fri May 14 09:00:35 EDT 2010 | rafacadiz
I attached a RX picture. A lot of voids and micro balls arround the flux residue. What do you think, relow temperature reflow or OSP poor weeting.? I appreciate your comments. Thanks,
Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef
Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept
Electronics Forum | Tue Jan 14 20:32:41 EST 2003 | davef
There's just about 4 beezillion companies that give solder training. Some are: * BEST Rolling Meadows, IL 847-797-9250 Bill Westmoreland (bwestmoreland@solder.net) http://www.solder.net/ * Circuit Technology 340 Raleigh St Holly Springs, NC 27540 (
Electronics Forum | Wed May 24 19:46:32 EDT 2006 | JohnM
So, it looks like the backward compatible of BGA statement is not guarantee for solder joint reliability. It doesn�t matter what temperature and what melting sequence we have in order to avoid the solder void issue. Is Pb diffused homogeneously thr
Electronics Forum | Fri Apr 20 14:11:27 EDT 2012 | rway
Programming is different, yes, but so is the terminology. ///with machine vision you have parameters that select what is good and what is bad, and you have parameters that help make bad look worse and good look better making the difference between w
Electronics Forum | Fri Jul 06 12:11:34 EDT 2007 | james
We are starting to see issues with using Kester WS R562 with lead free components. The joints look grainy on almost all of the 0402'2 and other small components. Some of the solder does not solder to the terminations. These are hybrid boards which
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