Electronics Forum | Thu Apr 05 10:50:08 EDT 2001 | CAL
Per our staff here at ACI......... Higher Temperatures maybe necessary to achieve good solder process results. The alloy formed when HASL coating protects the copper is the same as that when OSP provide protection. Temperatures may be increased to im
Electronics Forum | Fri May 07 18:34:55 EDT 2004 | Ron Herbert
Bruce, You didn't mention whether you had checked the specific gravity of the flux. Also, most flux manufacturers recommend getting rid of the flux after 40 hours of use.
Electronics Forum | Fri May 07 12:39:01 EDT 2004 | rontdc
Bruce, Using a foam fluxer with no-clean flux is a very touchy situation. It is imperative that the specific gravity of any flux be maintained within the manufacturers recommendations. If it is not, you will get icicles and bridging. Maintaining the
Electronics Forum | Tue Jan 13 22:43:11 EST 2004 | davef
We have seen this in reflowed parts, where there is flux res collected in the dimple in the solder, where the lead 'presses' in the solder. Generally, we attack this as a thermal issue: * Thermal pads sucking the heat away from the leads. * Leads no
Electronics Forum | Mon Apr 16 12:59:51 EDT 2001 | Mike R
If you will place a temperature strip on the board during wave soldering process you will get a max of 210 F or 98.8 C which is normal on the standard wave temperature. The problem on the 10% solder on the TH via hole can be caused by insufficient fl
Electronics Forum | Mon Apr 12 10:39:48 EDT 2004 | Ron Herbert
Correct preheating of the assembly is critical. Check with your flux manufacturer regarding the recommended topside pcb temperature as it enters the first wave. It is important that this temperature be achieved without burning the flux on the bottom
Electronics Forum | Thu May 06 19:13:24 EDT 2004 | Greg York
Watch your dwell time especially if larger components. Problem is normally associated with lower temp as well as insufficient flux coverage with larger massed boards or ground planes. Try to hand spray a board to check that fluxer operation is OK. If
Electronics Forum | Wed Jun 18 19:26:39 EDT 2003 | gregoryyork
Rules of thumb :- 1. Never over flux - not necessary and waste's money. Never top flux neither 2. Top Board temp. around 70C - 105C or there about's pending what laminate you use. Obviously the more flux you apply the higher heat required/denser PC
Electronics Forum | Thu Mar 31 17:27:36 EST 2005 | russ
Are we possibly talking palladium instead of platinum? I haven't yet heard of platinum terminations (seems expensive) If it is palladium over nickel, I can tell you that you need to reach 225-230 Deg. C in reflow and the TAL should be about 90 sec.
Electronics Forum | Wed Nov 02 12:08:40 EST 2005 | chunks
It could be lack of preheat or flux. You can verify the flux by hand applying. I'll bet it's lack of preheat though. That's usually the case with selective solder.
