Electronics Forum | Wed Nov 13 01:53:12 EST 2019 | elfridaauston87
WEll said dear.
Electronics Forum | Tue Aug 20 21:39:29 EDT 2019 | sssamw
6 mil (0.15mm) for the 1.13mm pitch BGA, and 4 mil (0.1mm) for the smal QFN with 0.4mm pitch.
Electronics Forum | Mon May 20 12:01:37 EDT 2019 | gregoireg
I have a PCBA job which has on the top side a few standard QFN components (0.4mm pitch) and a big module (35mmx60mm) with 1.13mm BGA pads: https://imgur.com/a/YUGgejW To be clear, this module is composed of a PCB with some components on top and some
Electronics Forum | Tue May 21 15:36:22 EDT 2019 | gregoireg
Thanks to @davef and @Evtimov for trying to help. It's useful but not exactly the answers I would like to get. I'm going to reformulate my question. I'm writing in mm so that it's more precise: I have a 0.12mm-thick stencil for some 0.4mm-pitch QFN
Electronics Forum | Thu May 23 10:18:02 EDT 2019 | emeto
A little hard to tell without knowing your part details and behavior and your PCB design. I have seen part warping so much that will show opens joints on the sides and short in the middle at the same time. Theoretically you should have area ration of
Electronics Forum | Mon May 20 16:15:48 EDT 2019 | davef
Resources are: * IPC-7525A - Stencil Design Guidelines, 3.5.2 Step-Up Stencil This type stencil is useful when it is desirable to print thicker solder paste in a small portion of the stencil. An example would be a ceramic BGA where it is necessary t
Electronics Forum | Wed Dec 11 13:00:07 EST 2019 | slthomas
Excessive mask thickness also can wreak havoc on stencil printing.
Electronics Forum | Tue Jun 07 08:31:57 EDT 2011 | bootstrap
I am building a rugged digital video camera product that essentially is just a sandwitch of 3 parts: #1: front piece is machined aluminum with C-mount thread #2: middle piece is 1/16" printed circuit board #3: back piece is machined aluminum The
Electronics Forum | Tue Jun 07 10:38:34 EDT 2011 | davef
Boots: Here's several methods for guessing at the amount of solder on your connection: * First, 'Down & Dirty' ** Assume that the solder is flat, which is reasonable since it's 'flattened' by the component package ** Assume 100% paste transfer from t
Electronics Forum | Mon Apr 23 14:59:56 EDT 2001 | relensky
I have been using pallet from Integrated Ideas and Technologies (www.integratedideas.com). They offer a "laminated" pallet that can have the various layers cut in several thicknesses. They are very helpful and willing to solve problems. The best p
