Electronics Forum | Thu Feb 27 02:55:53 EST 2020 | hexton
I want to avoid peoples preferences as they will differ and will not be a deciding factor. A heat gun will introduce risk to surrounding PTH components and having to add protection for those, will limit any gain in productivity. There is no question
Electronics Forum | Mon May 12 12:58:07 EDT 2014 | emeto
Hello all, I have a diode(gold plated)on some assemblies that gives me a a hard time. The paste is wetting too good and climbs the lead of the component and touches the body which is a defect. I just wonder what if there is a way to heat the board e
Electronics Forum | Mon May 12 15:13:29 EDT 2014 | emeto
Thank you guys. As we are speaking I keep examine the problem and here is what I got so far. 1. I measured the temperatures on my profile and the lead is hotter than the board. The lead goes 12 seconds earlier than the pad and is taking the solder.
Electronics Forum | Tue Sep 18 12:05:08 EDT 2001 | jschake
Optimal Print Parameters: I have responded to a similar question in the thread titled �Stencil Printing For 0201 Applications�, posted by markt and will refer you to that for addressing this question. If you seek clarification on any of those point
Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
Electronics Forum | Wed May 10 06:21:59 EDT 2000 | GOLI
I have been tasked to evaluate the performance of 0201 capability of machines. I trying to find out what kind of paste and stencil design most suited for the task. Does anyone share their experiences with 0201 components?
Electronics Forum | Tue Jun 02 17:32:53 EDT 2015 | jldowsey
Les, Some of the answers to design or stencil aperture/placement machine depend upon what is the current spacing between your components which you didn't specify. Chip components such as 0402's and 0201's typically have very small reductions in pas
Electronics Forum | Wed Jun 14 09:34:25 EDT 2017 | cyber_wolf
In my experience there is no need for wet wiping stencils. We run 0201'and micro BGA's daily with no issues. If you are having paste release issues, I would be looking at other things. Aperture area aspect ratio, aperture design, land design, sold
Electronics Forum | Thu Jun 15 07:20:23 EDT 2006 | William G.
How are your experiences with stencilling 0201 components on large circuit boards, i.e. 400 * 250 mm ? Will there not be too much mismatch between between stencil and (FR4) boards? If so, would dispensing be a solution? Any other solutions?
Electronics Forum | Wed Sep 01 11:09:45 EDT 2004 | burgosa
We are considering the CyberOptics SE300 for solder paste inspection at post-stencil print. Does anyone have experience with this AOI machine? How it works with small apertures like 0201's and uBGA's? Comments are welcome. Thanks
