Electronics Forum | Mon Sep 17 09:44:29 EDT 2001 | gresko
Dave, Ceramic sheets of that size are not always flat and as a result will sometimes crack when clamped along the full edge. Point clamping will hold the substrate secure for placement. If you are not processing in a pallet make sure that you have
Electronics Forum | Wed Jan 09 21:19:49 EST 2002 | davef
When I said "In this area, there is no difference between your experience in ceramic substrates and PTFE substrates." I was referring to the area we were discussing ... gold plating. I am sorry if you thought I ment than the wire bonding process wa
Electronics Forum | Wed Jan 17 18:42:49 EST 2007 | Richard
I'm trying to get an even solder coating onto a retangular shaped ceramic substrate (5.0mm x1.83mm), but the solder tends to pool on the short side of the substrate.
Electronics Forum | Fri Nov 30 11:49:20 EST 2007 | nkb2400
If the goal is selective soldering (not to raise the substrate temperature too high), consider the use of microwaves. Our company has been working on this technology for selectively bonding substrates. For example, we use the process to bond ROHS met
Electronics Forum | Mon Jan 21 16:13:50 EST 2008 | arun2382
We see delamination at Mold compound to substrate interface when tested for MSL3. We haven't tested the substrate for cleanliness. Can you please suggest methods for this? thanks, arun
Electronics Forum | Tue Apr 29 02:08:21 EDT 2008 | sin4d
Hi, I am also facing the same probelm. I assembly a substrate with a thickness of 0.30mm and the board warp after reflow. If I bake the substrate at 125 Deg C for 2 hours will it help to solve this problem? Thanks
Electronics Forum | Mon May 21 11:14:06 EDT 2012 | joeherz
Polymide is like a sponge and absorbs moisture much faster than rigid substrates. Pre-bake your substrate for 2-4 hours at 125C and perform your soldering within 1 shift thereafter or seal in moisture barrier bags.
Electronics Forum | Fri Sep 07 11:31:54 EDT 2012 | aquinn
Hi I am using an old Camalot 1818 to dispense squares of epoxy on a substrate. Does anyone know if it is possible to do an array of squares across the entire substrate rather than individually entering the coordinates of each square? Thanks!
Electronics Forum | Thu Jun 18 14:25:21 EDT 2020 | sara_pcb
We have observed Plastic BGA crack in encapsulation to substrate interface. After reflow, the device was not functioning. The Crack is observed in the fresh lot during visual inspection. What is the attachment process of package to substrate? where c
Electronics Forum | Mon Feb 07 13:40:41 EST 2000 | Dave F
Jose: Those are good guesses. Without knowing more, ask yourself: 1 There is probably adequate heat available, but that portion of the substrate that�s not soldering well is not receiving proper heating. Why is the component getting so hot, relati
