Electronics Forum | Fri Apr 26 05:50:54 EDT 2019 | ppcbs
We just apply tacky flux to the surrounding components and to the bottom side components under the BGA. This will prevent cold solder if any solder joints reach reflow temperature the surface tension will keep them aligned and in place. If you nee
Electronics Forum | Fri Jan 31 10:04:14 EST 2020 | emeto
Jinesh, My initial suggestion is you have too much solder past. Please try to reflow a few of these parts without solder paste. Colse aperture, put some tacky flux on this part location and give it a try. I bet you will not see any voiding.
Electronics Forum | Fri Jun 04 11:54:22 EDT 2021 | cbart
We do this quote often with our older Summit machine. there are a few ways to do this. all of these are assuming you have parts on the boards already and are working around them. 1- if you have a good tech that can add solder to the pads on the PCB a
Electronics Forum | Wed Nov 01 18:20:21 EST 2006 | russ
Flux is fine, make sure you have one that will withstand the extended and hotter reflow for the Lead free, your paste MFGR will most likely have the flux formula in their paste available as a tacky or paste flux Russ
Electronics Forum | Thu Aug 27 11:08:30 EDT 1998 | Richard Scarcelli
| Would like to know the following information on processing micro bga's: | 1) Fine mesh solder paste .vs. tacky flux --- which is best | 2) Stencil thickness for solder screen | 3) Aperature size for standard pitch balls | 4) Which direction is
Electronics Forum | Fri Aug 28 12:49:24 EDT 1998 | Earl Moon
| | | Would like to know the following information on processing micro bga's: | | 1) Fine mesh solder paste .vs. tacky flux --- which is best | | 2) Stencil thickness for solder screen | | 3) Aperature size for standard pitch balls | | 4) Which
Electronics Forum | Mon Jan 16 09:15:40 EST 2006 | russ
I can't see why it would be any different, You are melting the balls into reflow to the pad. In my opinion, paste is only useful in this situation to keep the part on the board during placement along with some planarity concerns in some instances.
Electronics Forum | Fri Jun 10 13:04:04 EDT 2011 | spitkis2
Any suggestions as to what can cause a PBGA's corner to warp down during installation process on a rework system? A couple solder balls bridge at the corner. It appears at the pin 1 corner where the metal indicator of a BGA is exposed. I am wonder
Electronics Forum | Mon Jan 17 17:38:29 EST 2011 | bandjwet
All: I am reaching out to get some suggestions on the right flux to use as well as a recommended cleaning process for soldering a KOVAR RF shield using 80/20 Au/Sn solder to a ceramic hybrid. The recommended profile is 4-5 min at 280C and at least
Electronics Forum | Mon Oct 27 16:58:34 EST 2003 | Stephen
The most common way is to screen print paste for the SMT placement, then then SMT placement then reflow then TH placement followed by wave solder. You won't be able to screen print for the BGA after reflow unless you use a mini stencil. Or you co
