Electronics Forum | Wed Sep 12 20:41:24 EDT 2001 | arul2000
Thanks David.I do not have any specific failure analysis to do now. But, like to use this technique in future. Appreciate your composure even during this time of unprecedented attacks. Regards, Arul
Electronics Forum | Fri Sep 21 21:43:16 EDT 2001 | dougk
We're used to placing the theromcouple on the solder joint and securing it with thermally-conductive UV adhesive. It's quick & easy to apply, and I've only seen a couple degrees difference from high-temp solder technique. Thoughts?
Electronics Forum | Mon Sep 24 20:38:27 EDT 2001 | davef
Mike's comments are well taken. Your technique works fine with BGA, but uBGA are less forgiving. Again, let's take about: * Specifics of the problem. * Amount and method of applying flux. * What's holding the uBGA in-place before the solder ball an
Electronics Forum | Fri Nov 09 13:50:50 EST 2001 | Jim Hammes
Any good advice on techniques to properly coat BGA devices on a PCB? Our preference is to spray the boards but I wonder if the coating will do much good. Thanks Jim
Electronics Forum | Wed Jan 16 07:03:46 EST 2002 | mattcorroboy
I am trying to find out some stats on the soldering of fine pitch devices. e.g. What are the chances of a short or open when a device is soldered using good techniques to a board. i.e. 1 in a 1000, 1 in a 1000000..?
Electronics Forum | Mon Apr 01 20:33:30 EST 2002 | davef
Regarding your underfil ... * What material did you use as an underfil? * What machine and technique did you use to apply the underfil? * What type of component were you underfilling? * What was the end-use environment?
Electronics Forum | Thu May 09 17:19:28 EDT 2002 | davef
Can�t help you with the article that you read. Other places to start are: * 2221, 7.2 Heat Dissipation Considerations, 7.3 Heat Transfer Techniques, and 8.1.10 Heat Dissipation * 2222, 9.1.2 Thermal Relief In Conductor Planes
Electronics Forum | Wed Mar 19 09:59:45 EST 2003 | davef
Jodi What's your thinking on the black pad rework technique proposed in: �A Failure Analysis And Rework Method �� Z. Mei, et al, SMTA International 1999, p407
Electronics Forum | Fri Feb 28 13:11:55 EST 2003 | russ
one more thing, have you checked out the ability to just hand solder by drag technique? This can be the fastest easiest way sometimes. Russ
Electronics Forum | Fri May 23 15:31:46 EDT 2003 | daanterstegge
Hi ChrisX, DPMO = number of defects per million opportunities. PPM (parts per million) is exactly the same, although the terminology is less clear about what it means. SPC(statistical process control) is a methodology based on statistical technique