Electronics Forum | Wed Mar 23 22:28:10 EST 2005 | KEN
I ran into this yesterday. Seems some designer decided to not solder resist the via's on the solder side. Then the assembly went over the wave solder in a universal fixture. Not an ideal situation.
Electronics Forum | Tue Jan 31 15:52:39 EST 2006 | russ
I have never related Solder mask layout to Black Pad. I don't see how they could be related but.......
Electronics Forum | Wed Feb 01 08:20:04 EST 2006 | Chunks
Can you post the site where you saw this? I've never heard of such a thing.
Electronics Forum | Wed Feb 01 16:04:10 EST 2006 | russ
Yes it does doesn't it! I wonder how this can cause black pad. Can you contact Saturn and ask them specifically? I browsed other PCB MFGrs. for this type of info and cannot find anyone else who claims this.
Electronics Forum | Wed Oct 25 13:02:54 EDT 2006 | billyd
Thanks all, for the help. Mydata pretty much parroted what was said here. My biggest issue is too many clowns in the circus tent. Thanks again guys.
Electronics Forum | Wed Feb 20 16:52:11 EST 2008 | pms
Yea, I'm still here.....sigh. Got bridging problems. These assemblies are SMT topside, then go thru wave for thru-hole components on topside. These assemblies have many, many, many vias VERY close together. We have a problem with solder from the wa
Electronics Forum | Thu Aug 20 04:37:03 EDT 2009 | sergey2007
Hi, I also paid attention on the solder balls.. I thought it was because of the pop-corning, but the customer told me the component was not damaged.. Regarding the bunch of tented vias, I need to ask the customer about that. Probably, they have unpo
Electronics Forum | Wed Jan 27 20:11:36 EST 2010 | plerma
What material is used to cap a via? Is it the > standard LPI Process/Material? we tent vias all the time, mostly to assist with assembly and the majority of the time outgassing is not a problem. What is the purpose in your case?
Electronics Forum | Tue Mar 03 02:39:56 EST 2015 | sarason
I would presume you reflow the top of the board first. Use tented vias. As you have worked out, vias have surface tension, which sucks the solder up the hole during reflow of the bottom of the board. Good luck! regards sarason
Electronics Forum | Tue Mar 03 03:11:57 EST 2015 | vb7007
Hi I also forgot to mention, top side is reflowed first at SMT. Tenting vias is good option. we are looking into it. Can you please also suggest any solution to avoid solder balls at bottom side in other places than vias. Thanks
