Electronics Forum | Thu Apr 20 22:46:26 EDT 2006 | samir
Amol, I thought I answered your question in another thread, dude! Anyway, to re-iterate. Yes, I was able to pull it off a hybrid profile. The LF BGA passed tensile testing, but no, it wasn't thermally cycled or stressed first to expose any latent
Electronics Forum | Fri Nov 23 16:09:01 EST 2007 | davef
We're not real clear about what you're trying to discuss, because most capacitors are packaged in epoxy with a solderable termination on each end. But lets throw a couple of ideas at the wall and see what sticks. If this epoxy is: * From the capaci
Electronics Forum | Mon Feb 01 16:40:45 EST 1999 | Dave Waddick
I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product is
Electronics Forum | Mon Mar 30 08:11:22 EST 1998 | Derek Drabenstadt
Does anyone have any experience with fired-silver/platinum/palladium lead terminations soldering. I have had issues on nickel over gold plated boards but not with HASL'd boards with tin/lead pads. Is this the norm?
Electronics Forum | Tue Feb 02 12:31:26 EST 1999 | John
| I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product i
Electronics Forum | Tue Aug 20 18:20:49 EDT 2002 | davef
Not more than 5 seconds. Iron tip temperature / solder alloy / flux composition / pad solderability protection / component termination solderability protection / cleanliness of the soldering iron tip / board design / ladeda
Electronics Forum | Sun Jun 22 13:24:49 EDT 2014 | davef
I don't know. We never had craziness like this before lead-free. You should have the yellowish-metal analyzed to be sure. Guessing: You're seeing this color on the terminations of components, not on the bulk of the SnX solder connection. If that's
Electronics Forum | Tue Oct 05 08:01:57 EDT 2010 | scottp
Have you confirmed in an SEM that the break is in the solder and not in the termination? If not in the termination, is it in the intermetallic rather than the bulk solder? It's unusual for the break to be in the solder joint when chips are knocked
Electronics Forum | Mon Oct 22 20:41:32 EDT 2007 | jkhiew
Hi Dave, The solder has tended to wet the component termination of Ag/Pd (chip capacitor) but has not wetted the pads, whereas the solder has wetted both termination & pads when using Ag/Ni/Sn finishes. Thks
Electronics Forum | Wed Nov 08 06:52:23 EST 2000 | Cristiano Dick Smiderle
I looking for a possible rework on component terminals that are not soldering in a wave solder machine. The terminals (leads) are very oxidated.
