Electronics Forum: texture and joint (Page 6 of 20)

SN100C alloy positive and negatives

Electronics Forum | Wed Dec 24 15:28:17 EST 2008 | edmentzer

We use SN100C for wave soldering and hand Lead free soldering and have had very good results. The wire cored solder for hand soldering flows good and makes very good solder joints. The SN100C in the wave solder machine also works very good. We use

Printer and Reflow Oven Recommendations

Electronics Forum | Fri May 22 12:42:43 EDT 2015 | deanm

Sr. Tech, you are right in that there is no verification of the profile. We are a Class 3 high mix OEM. We have visual inspection after SMT. We have not seen problems with wetting, grainy solder, cold solder, charred boards, etc. that would indicate

BGA ball and PCB pad

Electronics Forum | Thu Feb 12 10:19:46 EST 2004 | Bryan

Hi all, These days our customer asks us to figure out ,during reflow,the BGA ball and solder paste,which will first melt? I think it's very hard to get the rusult.coz I think it'll vary at diffrent part of the BGA,and how can this affect the perf

Solder beads and wave soldering

Electronics Forum | Mon Jul 10 09:25:47 EDT 2006 | nodlac

Here is a nugget from the Data Sheet... Wave Soldering: Excess moisture on the PCB during soldering may lead to random solder balling and poor wetting of some solder joints. IT IS IMPORTANT that the flux solvent carrier (water) is fully evaporated a

Wave Cassettes and Heat convection

Electronics Forum | Tue Jan 16 07:51:19 EST 2007 | realchunks

Your Quality Manager won't let you make changes, yet you get blammed for process problems? First, you need a change in management. Second, if you can't change set pre-heat temps, change the conveyor speed. Slow it down and see if your joints loo

ICT and specifying PCBA testing

Electronics Forum | Thu Mar 25 12:24:12 EDT 2010 | ssager

When testing components on a PCBA, try to validate coverage for presence, correct, orientation, live, and alignment. AOI is not really great at catching cold solder joints and damaged components, and from my experience an X-Ray is only as good as the

ICT and specifying PCBA testing

Electronics Forum | Fri Mar 26 15:17:30 EDT 2010 | jooh

Thanks for your replies! So what I understand is that ICT in reality is "only" a production process safety net, but it's a net that in most practical cases is needed. What ICT can not catch is (all) bad solder joints. What are the methods to find t

Re: BGA and Gold Boards

Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon

| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind

01005 components and reflow profiles

Electronics Forum | Mon Apr 09 20:55:46 EDT 2012 | action_101

I forgot to add that we are using a 3 mil stencil. It seems like to me that may be there isn't enough flux left when we reach liquidous?? About half of the solder spheres do melt and wet on each pad, but the top half of each solder joint is just the

Re: Intermetallics and reflow profile

Electronics Forum | Wed May 03 20:24:22 EDT 2000 | Dave F

MF: I know of nothing that addresses your question directly. Let me suggest: * Technical types at your solder supplier should be able to help. * "Effect Of Intermetallic Compounds On The Thermal Fatigue Of Surface Mount Solder Joints" PL Tu, et a


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