Electronics Forum | Sun Nov 07 10:54:21 EST 1999 | Steve Thomas
We're looking at redesigning our stencils to facilitate better (well, it's pretty much non-existant, so any improvement is a big leap) release from fine pitch apertures. Currently we have perpendicular walled laser cut apertures. We'll be having
Electronics Forum | Mon Oct 09 13:36:30 EDT 2006 | ppminc
Phil, The QSA-30 was built by Sam Sung, Sold by Quad. Single Head 2 Nozzles around 11K CPH Quad does not support the machine but I believe you can get parts direct from Sam Sung. I am not sure if they have a registration fee. The QSA used Quad made
Electronics Forum | Wed Aug 18 21:10:23 EDT 1999 | se
| | | Hi, | | | I'd like to ask some tips about the merits and shortcomings o | | | of both screen printer and stencil printer. For small quantity and highly mixed usage, which type of printer is suitable to our | | | application? | | | The board
Electronics Forum | Mon Jan 25 21:14:08 EST 1999 | Dave F
| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r
Electronics Forum | Thu Jan 21 09:27:33 EST 1999 | Earl Moon
Hello, I will be evaluating and qualifying two equipment types. The first is a fountain soldering device. I need practical advice on all the stuff you guys and gals know about as good, bad, ugly, best applications, setup, limitations, and all the re
Electronics Forum | Fri Oct 22 11:53:53 EDT 2004 | C Lampron
Hi Christina, What would you be basing the yields off of? Is it solder defect, component placement, etc....? I have worked for a flex house for quite a few years. You are right. The Polyimide is very dimentionally unstable. (even more so on humid da
Electronics Forum | Fri Jul 08 09:40:28 EDT 2005 | Jason Fullerton
"The only real problem we're seeing is some suppliers trying to use bismuth. That's a big no-no in a SnPb process and we won't accept those parts." Yes and no. Since the SnPbBi tertiary alloy melts at 96 degC, any product rated for storage above tha
Electronics Forum | Wed Apr 13 13:40:27 EDT 2011 | jebs
Hi. the res/cap is mostly 805, solder paste will be led free and will only have a few fine pitch IC on each board. The boards will contain between 140 - 160 components and will run a production of 300 - 500 each day with only one or two different boa
Electronics Forum | Fri Apr 15 13:25:40 EDT 2011 | tsvetan
agree, if you have fine pitch components the placement rate will be much less of what you see in the catalogues as they quote 0805 components placemen rate. I have one year log for one of our machine which is quoted to be 6400 cps and for one year a
Electronics Forum | Tue Feb 02 11:07:36 EST 1999 | justin.medernach@flextronics.com
| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r
