Industry News | 2022-10-11 17:22:18.0
SHENMAO America, Inc. has successfully developed a no-clean high thermal impact reliability solder paste. PF918-PW216 solder paste adopts the newly designed high reliability lead-free alloy (Sn/4Ag/3Bi) that achieves tensile strength performance 1.4 times higher than typical SAC305 alloys.
Industry News | 2021-01-17 17:50:26.0
The Assembly Division of MacDermid Alpha Electronics Solutions announces the release of ALPHA HiTechUnderfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.
Industry News | 2014-04-03 13:47:58.0
Indium Corporation will feature SACm™ solder paste at NEPCON China April 23-24 in Shanghai, China.
Industry News | 2015-05-13 14:00:03.0
The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.
Industry News | 2010-07-16 16:08:56.0
Practical Components, a leading international distributor of mechanical IC samples or “dummy” components and SMD production tools and equipment, announces in-stock availability of the popular 15 mm PoP Thermal Cycling Board.
Industry News | 2015-12-01 11:54:37.0
Indium Corporation was presented with the Global Technology Award for Best Products - Americas for InFORMS® high-reliability solder preforms, on Nov. 10 at Productronica in Munich, Germany.
Industry News | 2017-06-20 20:15:03.0
PDR introduces the benchtop based PDR IR-TS One IR Thermal Test System, designed to thermally cycle key critical components and assemblies to detect defects. Using PDR’s unique Non-Destructive Dual Thermal Stress Screening Process, based on a variation on HALT/HASS principles, the system is able to focus the testing on suspected problem areas to safely screen out early field failures caused by design, environmental, production and structural defects.
Industry News | 2017-02-28 20:41:01.0
PDR is pleased to introduce the new PDR IR-TS Series of micro-focused HALT/HASS thermal test systems. The PDR IR-TS One Bench Top System and TS-2100 Cabinet System have been designed to thermally cycle key critical components and assemblies to detect defects. Applications include testing electronic assemblies, electronic devices, bonded structures of plastics and ceramics in a wide variety of fields, including medical, automotive, avionics, space and defense.
Industry News | 2023-01-30 16:07:57.0
SHENMAO America, Inc. received a 2023 NPI Award in the category of Soldering Materials for its PF918-PW216 water-soluble high thermal impact reliability solder paste. The award was announced during a ceremony that took place Monday, Jan. 23, 2023 in San Diego.
Industry News | 2015-05-13 13:57:18.0
The current trend of miniaturization in microelectronics have paved the way for 3D packaging; allowing for lower manufacturing cost, increased memory and speed and a greater variation in functional uses of the miniaturized devices.
