Electronics Forum | Thu Feb 07 08:10:12 EST 2013 | emeto
Thank you all for the input. There is another concern. Do you consider wave soldering or selective soldering as a thermal cycle too?
Electronics Forum | Fri Jun 21 03:05:41 EDT 2019 | gregoryyork
The only problem with non silver tin bismuth is its very prone to shock damage and components fall off,literally. Would only recommend it with Silver additions and around 1%.
Electronics Forum | Fri Jun 21 03:07:28 EDT 2019 | gregoryyork
REL alloys from Aim solders maybe worth looking into for this application. May I ask what your profile on reflow is like please, especially peak
Electronics Forum | Sun Jun 30 20:00:56 EDT 2002 | redmary
the SOIC encounter solder crack after reliability test, the common process is: SMT---manual soldering---IPT(in process test)---potting---T/C(thermal cycling,only add current and voltage)---B/T and F/T (burn in and functional test). the condition is 2
Electronics Forum | Fri Feb 13 08:54:43 EST 1998 | justin medernach
| Hi , | I have not been able to find any good description on how to perform double sided reflow on PCBs.The best would of course be to avoid reflowing the bottom side again but in real life this is not possible. | So when double sided reflow sol
Electronics Forum | Mon Mar 13 22:29:50 EST 2006 | davef
Warp depends on: * How close the board gets to its Tg during the reflow cycle (the closer you get to the Tg the worse the warp gets) * Amount of copper on each side and the balance between the two * Thickness of the board * Overall length x width * T
Electronics Forum | Wed Jul 04 12:18:14 EDT 2012 | davef
Phil is correct in his description of proper rework technique. Possible explanations of the reason for popping of your BGA are: * Thermal cycling of components cause them to flex on a different point in the cycle that the board possibly resulting in
Electronics Forum | Mon Nov 12 10:57:36 EST 2001 | emmanuel
We are to use a PBGA 272 and a PBGA 388. Between 500 and 750 thermal shocks (-45�C/+125�C), we have noticed that some cracks appear in the solder joints. According to our component specialists, these cracks are due to the whole design (pcb, component
Electronics Forum | Wed Aug 15 01:30:56 EDT 2007 | wayne_
To be more specific. I am actually talking about the electrical fatigue whereby a unit is undergo a cyclic electric test. Unlike thermal fatigue, it is all talking about temperature related testing, eg, ageing test, thermal cycle test, etc. Anyone of
Electronics Forum | Tue Oct 15 20:33:43 EDT 2002 | davef
First, this is a very interesting question. Second, there is no specification. Third, companies develop guidelines for rework based on their expectations for their product reliability. Things to consider are: * Motorola allows no product shipments
