Electronics Forum | Tue Sep 28 11:58:09 EDT 2021 | stephendo
Do you mean reflow profiles are showing 20F above set points or is the oven display is showing 20F above set points?
Electronics Forum | Sat Jun 09 09:32:26 EDT 2001 | davef
Yes, your pallet will absorb / steal heat. It sounds like you are doing a good job in understanding the issues. Yes, the pallet could be the problem. Is this a new run that you are starting? Or has everything been OK, but recently you've begun to
Electronics Forum | Thu Jun 14 10:50:49 EDT 2001 | slthomas
I must be missing something.....why can't you simply attach thermocouples, profile the assembly, and adjust your zones as required to reach the parameters required by your paste and component specifications? Is there a restriction on that process fo
Electronics Forum | Wed May 03 20:24:22 EDT 2000 | Dave F
MF: I know of nothing that addresses your question directly. Let me suggest: * Technical types at your solder supplier should be able to help. * "Effect Of Intermetallic Compounds On The Thermal Fatigue Of Surface Mount Solder Joints" PL Tu, et a
Electronics Forum | Fri Jun 03 04:16:27 EDT 2005 | Bryan She
Background: We use a thermal boards to setup/profiling the reflow oven for pilot run.and then daily verify the reflow profile with this thermal board.Now we phased into LF production,and the LF thermal board can only withstand 25~30 times reflow excu
Electronics Forum | Tue Apr 09 08:44:43 EDT 2002 | davef
Read IPC-7530 "Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)". There is no advantage in dropping off much faster than 4�C/sec. In fact, you risk fracturing your newly formed solder connections due to board warping
Electronics Forum | Fri Jun 10 12:11:49 EDT 2005 | chunks
QS and ISO can really play a part here. If so, the best way I found was to run parallel T-couple ports to the thermocouples of the oven. Now you can run a board and gather all your thermal information and set your temps. Now use parallel ports to
Electronics Forum | Wed Apr 21 19:59:43 EDT 2004 | Ken
It makes no difference if the solder is in balls, ingots, bars, paste etc. The thermal profile satisfies key areas of the reflow process as a function of your flux and alloy type. Peak and duration above liquiduous are a function of the alloy. pr
Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella
When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so
Electronics Forum | Tue Aug 10 09:17:50 EDT 2004 | davef
The thermal recipe you use is dependant primarily on the solder paste that you choose.
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