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Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

E3M SMD Rework System for Micro Re Work

E3M SMD Rework System for Micro Re Work

New Equipment | Rework & Repair Equipment

PDR E3M  Rework System for Micro SMD Rework is made of only the finest materials and components for Micro- BGA Rework, 0201 Rework, CSP Rework, uBGA Rework, LED Rework, area Array Rework, and similar micro applications. Combining PDR's ThermoActive s

PDR-America

SRT Micra - Mobile Device SMT Rework System

SRT Micra - Mobile Device SMT Rework System

New Equipment | Rework & Repair Equipment

Mobile Device Rework System Revolutionary new heaters and power controls provide extremely high performance. Compact in design with SRT’s latest rework technologies, the Micra addresses the challenges of reworking technologies such as PoP, QFN

VJ Electronix

Official PACE IR 3000 Tutorial - Install and Remove BGA and SMC

Official PACE IR 3000 Tutorial - Install and Remove BGA and SMC

Videos

"The IR 3000 offers advanced surface mount rework capability in an integrated, cost-effective, bench-top work station." This video covers the basic processes of the IR 3000, focusing primarily on: Installations, Removals, Component Alignment and Ins

PACE Worldwide

Indium Solder Pastes

Indium Solder Pastes

New Equipment | Solder Materials

Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for

Indium Corporation

E3G BGA Rework Station

E3G BGA Rework Station

New Equipment | Rework & Repair Equipment

The PDR E3G Evolution - Next Generation Rework System -  is made of only the finest materials and components for optimum precision and rework excellence. Combining PDR's ThermoActive software technology with PDR's patented Focused - Visible IR Techno

PDR-America

Reworking a BGA with the PDR Focused IR-E3 (inc.BGA vision alignment) Rework Station

Reworking a BGA with the PDR Focused IR-E3 (inc.BGA vision alignment) Rework Station

Videos

This is an indepth video showing you how to rework a BGA using the PDR IR-E3 with CCTV/Split prism vision alignment rework station from our Evolution series. We call this system the E3Vi For further details on PDR Focused IR rework stations/systems

PDR-America

Reworkable Edgebond Adhesive Improves CBGA and BGA Thermal Cycle Performance and Eliminates Underfill

Industry News | 2011-04-07 20:23:54.0

Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.

Zymet, Inc

Via in Pad PCB

Industry News | 2018-10-18 10:38:59.0

Via in Pad PCB

Flason Electronic Co.,limited

Reworking a BGA with the PDR Focused IR-E3 (inc.BGA vision alignment) Rework Station

Reworking a BGA with the PDR Focused IR-E3 (inc.BGA vision alignment) Rework Station

Videos

This is an indepth video showing you how to rework a BGA using the PDR IR-E3 with CCTV/Split prism vision alignment rework station from our Evolution series. We call this system the E3Vi For further details on PDR Focused IR rework stations/systems

PDR-America


thermal relief bga pad searches for Companies, Equipment, Machines, Suppliers & Information

Pillarhouse USA for Selective Soldering Needs

High Throughput Reflow Oven
One stop service for all SMT and PCB needs

Training online, at your facility, or at one of our worldwide training centers"
Electronics Equipment Consignment

World's Best Reflow Oven Customizable for Unique Applications
Sell Your Used SMT & Test Equipment

Easily dispense fine pitch components with ±25µm positioning accuracy.
PCB Depanelizers

Low-cost, self-paced, online training on electronics manufacturing fundamentals