Electronics Forum: thorup (Page 6 of 24)

Solder Paste Thickness Measuring Device

Electronics Forum | Wed Mar 17 17:30:53 EST 2004 | johnthor

hello Dreamsniper I'm assuming that you want an inexpensive yet accurate instrument to periodically verify your process/machines. A focussing microscope with a small depth of field is quite useful. You simply focus on the board, then refocus on the

Can I use lead free BGA parts in a lead based process?

Electronics Forum | Tue Jun 15 09:26:00 EDT 2004 | johnthor

There was a thread in the IPC TechNet a few days ago about this subject. Basic conclusion was that there is a reliablility concern if the lead free balls don't reach liquidus with the Pb profile. Haven't tried it myself. John Thorup

no-clean vs. water soluble

Electronics Forum | Wed Sep 13 12:36:14 EDT 2000 | Steve Thomas

In the following thread, http://www.smtnet.com/electronicsforum/view_message.cfm?message=9584& John Thorup touched on some applications where no-clean fluxes could be a bad idea. I'm looking for some more detailed info. (papers, references, texts

Re: Ceramic case resonators falling to pieces after reflow soldering.

Electronics Forum | Wed Aug 30 14:57:43 EDT 2000 | John Thorup

Hello Craig Are code dates other than these two coming apart or do they stay together? If other dates stay together you should get together with RFM. Did the process work before and and the defects just start happening? These are pictured on the RFM

Re: solderballs after wavesoldering

Electronics Forum | Tue Aug 22 14:52:55 EDT 2000 | John Thorup

Jax - absolutely right - the archives are a valuable tool and deserve to be used more than they seem to be. Caumel - Are your blobs on the solder side or the component side? Are your vias tented on the component side? What size are your vias? Is th

Re: attaching thermocouples

Electronics Forum | Wed Aug 16 17:42:02 EDT 2000 | John Thorup

Hi Steve You really didn't tell us what is going wrong. Not enough heat to melt this hi temp solder (290C/554F)? Too much heat and burning up the pad/board? Thermo falling off? (remove all the original solder) You won't find Loctite 384 all that remo

Re: Plastic tape carrier blues.

Electronics Forum | Fri Aug 04 10:08:18 EDT 2000 | John Thorup

Zactly...what type and size of component. Pressure sensitive or heat seal cover tape? Manufacturer or service house taped? One or all manufacturers/distributors. Are the components in the right size tape? Reasonably recent production? Are they rea

Re: DIGITIZER

Electronics Forum | Fri Jun 30 15:12:55 EDT 2000 | John Thorup

Hi Walter It might be a stupid question but have you tried cal comp? This is a current model and they shouldn't have any trouble supporting it. www.GTCOcalcomp.com Did you buy it with the Mydata? Most of their options have to be activated with a "se

Re: HASL?

Electronics Forum | Thu Jun 29 10:11:06 EDT 2000 | John Thorup

Hi Bob, welcome Let's take this a little further. You'll also see HASL referred to as HAL and gold referred to as ENIG (electroless nickle, immersion gold. Other common surface finishes for preserving solderability include OSP(organic suface protect

Re: HASL Plating Thickness

Electronics Forum | Thu Jun 29 10:38:04 EDT 2000 | John Thorup

Hello Christopher I don't know if there is any kind of official standard but I can tell you that the HADCO DFM manual specifies a nominal thickness of 50-1500u" with an option for 100-1000u" and the Merix DFM manual specifies 30-200u" Our boards (fro


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