Electronics Forum | Thu Nov 04 04:27:46 EDT 2010 | d0min0
thanks for all the feedback... we also checked, just in case : - bake the components (no visible improvement) - bake the pcb (50% less tombstone components) - finally we changed LF paste to completely different manufacturer - and booom 0 (zero) tombs
Electronics Forum | Thu Oct 28 08:28:33 EDT 2010 | d0min0
Hi, previous topics found closed so I couldn't continue on them, but wanted to ask maybe something that we don't already know paste shape and placement ok, reflow 12 zones profile looks ok (same since 2 yrs), component placement ok, one reference i
Electronics Forum | Thu Oct 28 16:15:24 EDT 2010 | duchoang
If everything else is OK, capacitors quality could be the cause of this issue. Some caps could have been contaminated or the metal mass not even between two ends. Try different kind (manufacturer)of cap.
Electronics Forum | Sun Oct 31 11:07:09 EDT 2010 | Mark
http://www.shanelo.co.za/Article%20to%20assist%20with%20Stencil%20Design%20Guidelines.htm Stencil design
Electronics Forum | Tue Nov 30 07:53:16 EST 2010 | edmaya33
could be a printer or stencil issue. try to check your printing repeatability. Suggest to use SPI for a checking paste volume/height/area.A regular stencil cleaning may reduced your headache.
Electronics Forum | Thu Oct 28 16:11:43 EDT 2010 | dwonch
Dealing with these intermittent issues can be frustrating! Can you narrow down if the defects occur during a specific time in the run? i.e. beginning or end? Or, maybe after a pause in printing such as stopping the line for lunch? Are there a lot of
Electronics Forum | Thu Jul 20 14:05:59 EDT 2000 | Mike McMonagle
With 0402 components becoming more common today outside of the telecommunications industry, our company is qualifying equipment and processes for an upcoming product incorporating 0402s. Having used 0402s in a previous position, I am planning a DOE o
Electronics Forum | Fri Mar 06 16:17:38 EST 2009 | aj
whats your board finish?
Electronics Forum | Fri May 06 08:39:59 EDT 2016 | kahrpr
The first issue I see is that you have a high potential of the 402 tombstoning.
Electronics Forum | Thu Mar 05 11:53:09 EST 2009 | dcell_1t
Hello to all. for certain time, we have been struggling with some issues on a PCB where have tombstoning on 0402 components (due to pad design) and dewetting in qfp256 0.5 mil pitch (discussed on another threads on this forum) component, we have pro
.gif)
