Used SMT Equipment | Pick and Place/Feeders
Product number: YV100 Products in detail YAMAHA multi-function chip mounter YAMAHAYV100A Substrate size: ATS20 (end to put) W - ATassembly: L460 * W250 (Max)/L50 * W50 (Min) Substrate thickness: 0.4 to 3.0 Substrate transfer direction: right and
Used SMT Equipment | Pick and Place/Feeders
Product number: YV100X Products in detail YAMAHA multi-function placement machineYAMAHA YV100X substrate size: ATS20 (end to put) W -AT assembly: L460 * W250 (Max)/L50 * W50 (Min)substrate thickness: 0.4 to 3.0 substratetransfer direction: ri
Used SMT Equipment | Pick and Place/Feeders
Product number: YSI- v Products in detail Object substrate: L50 W50mm ~ L330 W360mm xx (1) does When using standard components: absoluteaccuracy (including + 3 sigma) : + / - 0.05 mm/QFP Repeat accuracy (3 sigma) : + / - 0.03mm/QFP SMT capacity:
Used SMT Equipment | Semiconductor & Solar
Product number: YV100X Products in detail YAMAHA multi-function placement machineYAMAHA YV100X substrate size: ATS20 (end to put) W -AT assembly: L460 * W250 (Max)/L50 * W50 (Min)substrate thickness: 0.4 to 3.0 substratetransfer direction
Used SMT Equipment | Chipshooters / Chip Mounters
YAMAHA YSM10 PICK AND PLACE MACHINE SPECIFICATION :YSM10 Object base size :L510 x W460 mm ～ L50 x W50 mm ※Optional accessories can correspond to the L610mm substrate Mounting capacity:HM mounting head (10 nozzles) specification /HM5 mount
Used SMT Equipment | Chipshooters / Chip Mounters
Yamaha SMT YSM10 Placement Machine Applicable PCB L 510 x W 460mm - L 50 x W 50mm * Consult us for board sizes exceeding dimensions L510 Mounting capability HM Head (10 Nozzle) Spec. HM5 Head (5 Nozzle) Spec. 46,000CPH (The Comp
Used SMT Equipment | Screen Printers
2.0 Cmk @ ± 12.5 μm (± 6 sigma) System alignment capability > 2.0 Cmk @ ± 25 μm (± 6 sigma) Optimum core cycle time 8 seconds Substrate size 50 mm (X) x 40.5 mm (Y) to 620 mm (X) x 508.5 mm (Y) Operating System Windows 7 Embe
Used SMT Equipment | SMT Equipment
Model:YV88X middle speed multifunctional Chip mounter Placement Speed: Chips :6540cph(0.55sec/chip) QFPs:4000CPH(0.9sec /QFP) Placement Range:0.6X0.3mm~□54mm or 100x32mm Placement Station:94 Stations/Tray80 Power Supply:3P/200V-41
Used SMT Equipment | SMT Equipment
Product name: JX - 300 led high-speed chip mounter Product number: JX - 300 led Products in detail The most suitable for LED lighting, large LCD back light in a machine or production of the LED placement machine was born Chip components 27100
Used SMT Equipment | SMT Equipment
mind vision camera, 0603 - more than 31 type components, 45 mm long connector (L100mm x W45mm) - - more than 45 type vision camera Substrate size: (limited to the host) : L460 x W440mm (Max) ~ L50 x W50mm (Min) Substrate thickness/substrate weight:
