Electronics Forum: trs and 5 (Page 6 of 36)

BGA's and the Fuji IP2

Electronics Forum | Mon Jul 15 17:35:42 EDT 2002 | davef

Micro BGA � (�BGA�). A Tessera brand name for a fine [0.5 mm and 0.75 mm solder ball] pitch BGA.

mirae pick and place machine

Electronics Forum | Sat Apr 12 00:48:35 EDT 2003 | MA/NY DDave

Hi I want to echo the above good advice. Be careful that you either buy a machine from a company that will be here 5 years out or you buy training, equipment documentation and spare parts to cover you. YiEng, MA/NY DDave

V-scoring design and equipment questions

Electronics Forum | Tue Jun 13 08:33:11 EDT 2006 | davef

IPC-2222, 5.3.1 defines the parameters of making scoring cuts and the tolerance of the cuts, but does not specify the cuts. Our spec for 0.062" thick FR-4 boards is: 0.018-0.024"

Placement Equipment and Long Boards

Electronics Forum | Thu Apr 05 08:57:47 EDT 2007 | ck_the_flip

Which placement equipment in the market can handle boards that are 21" (539.5mm for you fuzzy foreigners) or more?

Placement Equipment and Long Boards

Electronics Forum | Fri Apr 13 10:57:50 EDT 2007 | bigguy

hi we have an Essemtec FLX 2010 L that has a large board capacity of 600x700mm(23.6x27.5")

Placement Equipment and Long Boards

Electronics Forum | Sat Apr 14 10:21:30 EDT 2007 | HOSS

We are processing a 5x22" PCB using Juki "2010E and 2060E". Machines are spec'd as 18x20" cabable. We just needed to adjust a conveyor sensor (1 time) and ignore a few placement area warnings.

Leaded and Lead-Free Wave Parameters

Electronics Forum | Fri May 23 18:55:20 EDT 2008 | gregoryyork

This is one of the biggest mistakes with the Lead Free process. We have all listened to the 'industry experts' and followed their advice and unfortunately got it wrong. Keep the dwell times (dependant on alloy selection) the same as Leaded so you are

01005 components and reflow profiles

Electronics Forum | Mon Apr 09 21:09:29 EDT 2012 | isd_jwendell

I haven't worked with anything as small as 01005s, but something you didn't mention is the %metal of your paste. I just switch from 90% to 89.5% (AIM NC257-2) and could tell the difference. Just an idea...

Solder Balls and conformal coating

Electronics Forum | Fri Apr 05 15:24:14 EDT 2019 | sever_83

What can cause solder balls to appear after conformal coating? Using Dymax 9-20557, light curing for 1.5 mins. Can too much heat from light cure cause solder balls?

Re: When? How and What??

Electronics Forum | Tue Aug 22 10:47:28 EDT 2000 | Dr. Ning-Cheng Lee

The European WEEE has issued a new (5th) version of its recommendations. In it they say that , on January 1st, 2004, they will review the status of the Pb-Free issue. There is currently NO DEADLINE for implementation. As far as a direct replacemen


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