Electronics Forum: two passes (Page 6 of 22)

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 16:06:32 EST 2000 | eLDON sANDERS

Gentlemen, I too have been atacked by that "soldering to gold" and will add my 2 cents. I also had parts that would pop off the board when the fillet looked perfect. After lots of pain, experimentation, and sleepless nights, I solved it through a

Re: lid soldering problems (CQFP, Au/Sn solder)

Electronics Forum | Tue Sep 22 10:52:31 EDT 1998 | Wayne Bracy

| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material

Quad IVc Fiducial Alignment

Electronics Forum | Mon Jan 21 08:26:45 EST 2013 | ngineer

Bobpan, Thanks for the reply. I have been using Tep Vision, I'll see whether I was using GOTO 1 or 0, it may have been 0. I am running from central controller, and am doing a download database from the database utilities when making changes on

Jig for PCB

Electronics Forum | Tue Apr 18 12:34:15 EDT 2006 | Chunks

Outside the box: Can you retro your oven with a belt chain combo? I always order my ovens this way just in case. No pallet or carrier needed then. Can justify retro against the cost of the pallet or carrier. Two part epoxy instead of heat cure?

Just finished a VOC-FREE FLUX Evaluations

Electronics Forum | Thu Jan 14 13:25:53 EST 1999 | Chrys

| Hi Folks. Has any Process Engineer here done a complete evaluation or controlled experiment for VOC-FREE Flux? Our goal here at CEBUKid, Inc. is to implement a VOC-FREE process. We have all the necessary (OPTIFLUX) spray equipment, and we're cur

Re: Just finished a VOC-FREE FLUX Evaluations

Electronics Forum | Mon Feb 22 16:39:33 EST 1999 | C.K.

| | Hi Folks. Has any Process Engineer here done a complete evaluation or controlled experiment for VOC-FREE Flux? Our goal here at CEBUKid, Inc. is to implement a VOC-FREE process. We have all the necessary (OPTIFLUX) spray equipment, and we're c

Re: DFM Guidelines or solderability?

Electronics Forum | Thu Aug 20 15:29:45 EDT 1998 | D. Lange

Re: Questions #2 Are you having solderability problems with that arrangement? Sounds like problems could be solved at the wave solder. If the customer has already spun pcb then sometimes for low volume it would be easier to correct the problem at wa

Re: Troubles with parts recognition

Electronics Forum | Wed Feb 23 11:12:47 EST 2000 | TMV

This note is in response to your question about not being able to recognize a component that is running on a 4796 but has problems on a 4791. The 4791 and 4796 used two different recognition systems and the lighting calibration will be not be the s

Re: Troubles with parts recognition

Electronics Forum | Wed Feb 23 11:12:47 EST 2000 | TMV

This note is in response to your question about not being able to recognize a component that is running on a 4796 but has problems on a 4791. The 4791 and 4796 used two different recognition systems and the lighting calibration will be not be the s

2-sided BGA

Electronics Forum | Tue Jan 30 21:13:26 EST 2001 | davef

Two options: 1 Glue 2 Use a dedicated work holder with 'pockets' milled out to accommodate the components on the first side of the board after reflow. Some prefer a pallet that runs all the way through their process. So, these pallets: * Feature


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