Industry News | 2007-02-05 13:03:47.0
Multi-tech Stencil Cleaner provides ultimate chemistry flexibility
New Equipment | Cleaning Agents
IONOX® BC is a general purpose semi-aqueous solvent blend specially designed for effective removal of flux residues and dried uncured adhesives. IONOX® BC is approved for manual stencil cleaning as well as underscreen wipe applications. Manufactur
New Equipment | Cleaning Agents
AQUANOX® A8820D is a pour and go, engineered micro-cell cleaning fluid designed to remove wet solder paste and uncured adhesive from stencils used with the surface mount printing process. No Mixing or Monitoring For Spray-in-Air & Select Ultrason
New Equipment | Cleaning Agents
200°F~93°C Boiling Point: 292°F~144°C Water Soluble: Partially miscible VOC, @ 10%: 88.45 g/L Typical Processes Application: Spray-in-Air / Select Ultrasonic Stencil Cleaners Concentration: 25% Temperature: Ambient to Rinse: Optional Dry
Industry News | 2009-05-26 18:45:31.0
TORRANCE, CA � May 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will exhibit the Sawa SC-500GE portable cleaner, as well as product literature for all Seika products at the upcoming SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 11, 2009 at the Sheraton Bloomington Hotel in Bloomington, MN.
Industry News | 2008-07-22 13:24:53.0
Starting at less than $8000...and it's a Smart Sonic!
New Equipment | Cleaning Agents
KYZEN E5631 is designed to be used at low concentrations and ambient temperature in stencil cleaning processes including spray-in-air, understencil, and ultrasonic systems. E5631 was formulated with the worker and environment in mind and is a cost-ef
Industry News | 2004-02-20 12:15:19.0
Tabletop Stencil Cleaner
New Equipment | Cleaning Agents
AQUANOX A8820D is a pour and go engineered micro-cell cleaning fluid designed to remove wet solder paste and uncured adhesive from stencils used in surface mount printing processes. A8820D removes all un-reflowed solder paste using spray-in-air and s
New Equipment | Cleaning Agents
KYZEN E5611 is a concentrated aqueous cleaning chemistry designed to remove non-reflowed solder paste and uncured chip bonder adhesives from stencils and hardware following the printing process. E5611 works on a wide range of solder paste technologie
