SMTnet Express, June 12, 2014, Subscribers: 22834, Members: Companies: 13899, Users: 36331 Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow Arijit Roy; World Academy of Science, Engineering
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
Fragility of Pb-free Solder Joints News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Fragility of Pb-free Solder Joints Universal Instruments Credit/Source: Peter Borgesen
; BlackBerry Limited , University of Waterloo
SMTnet Express, December 14, 2017, Subscribers: 30,979, Companies: 10,811, Users: 24,182 PCB Sourcing Using PCQR 2 Al Block, Naji Norder, Chris Joran; National Instruments In a global market, it is often difficult to determine the best PCB
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