Electronics Forum | Tue Feb 19 23:00:29 EST 2008 | amarpreet41
Connector pin - 10.83 mils Hole dia - 27 - 33 mils. We are trying to find the optimam level for hole dia.
Electronics Forum | Wed Feb 20 09:05:38 EST 2008 | tonyamenson
We had a similar problem with lead-free through-hole components. We baked those baords to remove the residual moisture and everything went to 100% pass - defect was gone. Couldnt hurt to try a sample run while you decide if the PCB holes need to be
Electronics Forum | Wed Feb 20 09:29:19 EST 2008 | mun4o
ni, I had similar problem too.I bake PCB in SW mashine - about 8h ,T=90 C.Problem is in the base material of PCB - there are moisture in the material.After my complaint to PCB factory , they change material and the problem disappear.
Electronics Forum | Mon Jan 21 18:58:21 EST 2008 | davef
We have read papers espousing using xray, but have never seen such a thing. It seems the contrast provided in the xray images is insufficient for analysis of the underfill.
Electronics Forum | Tue Jan 22 07:50:20 EST 2008 | rayjr1491
Thanks Dave, I spoke with a Loctite application person yesterday and the mentioned SAM as well. best regards, Ray
Electronics Forum | Tue Jan 22 09:48:09 EST 2008 | davef
Here's an article on flux / underfill compatibility http://ap.pennnet.com/articles/print_toc.cfm?p=36&v=16&i=6
Electronics Forum | Wed Feb 05 15:16:15 EST 2003 | davef
If the voiding is not related to entrapped air in your vias, consider trying a different paste.
Electronics Forum | Fri Aug 06 10:27:05 EDT 1999 | Kenneth Hedman
| | I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | | | Thank you, |
Electronics Forum | Thu Feb 19 14:21:35 EST 1998 | Earl Moon
| what is your experience about the presence of the voids in the joints ? | Are they dangerous and when ? Correct from 2% to 20% voiding unacceptable.
Electronics Forum | Wed Sep 01 10:15:44 EDT 2010 | arjan
Dear Sachu_70, During the tests we also checkt other devices, there are a few small voids visible, but they are marginal. We only see large voids in this device. During the testruns we tried several reflow profiles, but without large succes.
.gif)
