Electronics Forum | Thu Oct 12 13:15:37 EDT 2017 | davef
It is the two conditions pictured in IPC-A-610F, Figure 5-1 C, D. In the old, simplier days, we wanted our solder connection to have: * Low wetting angle * Shiny metal Today, the metal doesn't have to be shiny and the wetting angle can be a high
Electronics Forum | Tue Apr 17 10:22:16 EDT 2001 | tom g
Has anyone out there had solder joint wetting issues with Murata ceramic chip caps, in particular with Alpha UP78 no-clean paste? We are finding that changing either the paste or the vendor corrects this problem. If so, please advise your solution(
Electronics Forum | Thu Aug 24 13:09:30 EDT 2000 | Dr. Ning-Cheng Lee
Yes, a flux with a fast wetting rate will be more prone to have spattering. Fluxes with high boiling point solvents are also more prone to have spattering, if the same flux is fast in wetting rate.
Electronics Forum | Thu Nov 04 21:36:36 EST 1999 | chris
Hi John, Thanks to your reply, just one question is it possible that the solder paste ( flux material )applied to the pads cause the non-wet. regards Chris
Electronics Forum | Thu Mar 11 17:33:01 EST 1999 | Scott
Kester is no longer in the equipment business. Robotic Process Systems (the orginal maker) is now selling and servicing the Micro wetting balances, Steam agers, and dip and look testers
Electronics Forum | Wed Sep 05 16:29:08 EDT 2001 | davef
Check the fine SMTnet Archives [wetting and balance] of the Forum. You should get a Bob Willis discussion on solderability testing as a bonus.
Electronics Forum | Wed Oct 02 00:08:26 EDT 2002 | praveen
Hi, We are using chip components with Silver Pladium coating and finding poor wetting. We are using the water wash solder paste with 2Ag and std. reflow profile. Any suggestion how ti improve the solder wetting for those components. Thanks,
Electronics Forum | Wed Oct 02 00:08:39 EDT 2002 | praveen
Hi, We are using chip components with Silver Paladium coating and finding poor wetting. We are using the water wash solder paste with 2Ag and std. reflow profile. Any suggestion how to improve the solder wetting for those components. Thanks,
Electronics Forum | Thu Oct 03 10:02:08 EDT 2002 | davef
Your problem is likely not the Pd-Ag surface layers, but the underlying metal to which you need to wet. Either a base metal is: * Contaminated and poorly wettable. OR * A material [eg, Alloy 42 (check with magnet), Kovar, etc] that is inherently dif
Electronics Forum | Wed Apr 21 21:50:28 EDT 2004 | adam
Hi I recently having problems on the components having non wetting on the flex circuits. The profile that I am using is according to the solder paste suppiler recommended. Can anyone pls. advise? Regards
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