Electronics Forum | Wed Jun 13 13:50:49 EDT 2001 | DaveG
I don't have any actual "hard" data to give on improvements but, I can share some experiences with you. What we noticed when we implemented the Rheo pump was: No more solder "skips" on our boards, Improved print quality on our BGA's & 16mil fine pitc
Electronics Forum | Sun Jul 08 23:05:57 EDT 2001 | Darby
John, Tenryu/Amistar/i-Pulse made stainless replicas of feeder tape for various pitches and feeder widths. Part # for 0402 is "MT-0802" ( 8mm wide x 2mm pitch ). Standard 8mm wide tape is " MT-0804". If you can't get any of these, spend an hour on yo
Electronics Forum | Thu Jul 12 21:41:35 EDT 2001 | mugen
A) Questions: 1) What sort of pallet materials used? 2) what PCB thickness & LxW size? 3) what stencil type & thickness used? 4) what profile type used (peak deg-C)? 5) any peak Deg-C contraints for the components SMT onto the PCB? B) We use pallet
Electronics Forum | Mon Jul 30 02:01:15 EDT 2001 | mugen
Hey....sneaky smartie here.... my finance manager, would love to have you on the MRB team.... Anyway, most technical paste specs, do highlight the possibility, should the paste become "dry" or "sticky", we MAY recondition the paste, by "place it fro
Electronics Forum | Thu Jul 26 21:16:18 EDT 2001 | djarvis
Dave, We don't do any inspection. Before everyone says "bull...t". Let me explain. We are an OEM. I spent six years in subcontractor hell and wouldn't go back for all the tea in China. It took me two years to convince them when I first got here but I
Electronics Forum | Mon Jul 30 12:41:47 EDT 2001 | hinerman
1. Realizing not all PCBs will be warped, but for those that are, the tooling can be set when the board is in contact with the stencil, which will take out some warp. On an MPM, the vacuum box helps to hold the board flat If the warp is more sever
Electronics Forum | Sat Jan 22 20:59:51 EST 2000 | Jeff Sanchez
Michael, I am not sure if you are trying to lay out a board with vias in the pads or suffer through an assembly you got stuck with? I am building run of boards right now that has vias in most the smt pads. I'm sure the design group thought it was
Electronics Forum | Thu Jan 06 17:56:14 EST 2000 | Brian W.
I agree with Dave that passte volume is the most preferable criteria. However, you need to determine what you will accept and what your process is capable of. You need to define the process parameters, put procedures in place to control them, reduc
Electronics Forum | Tue Dec 14 17:02:04 EST 1999 | John Thorup
Hello Kris If you do have and OSP coating I'd say Curtis has nailed it. But you seem to have references to gold. Does this board have a standard nickle/gold finish. If so what sort of "solder on gold" problems were you having? Reading between the
Electronics Forum | Thu Dec 16 06:59:43 EST 1999 | Christopher Lampron
Calvin, We have found several reasons for solder beading occurance. We have found that solder balling is usually directly attributed to the reflow profile while solder beading is usually (but not always) a result of either excessive solder paste volu
