Electronics Forum | Mon Mar 08 11:14:20 EST 1999 | Skip
| Well I don't know if this is advertising or not but the registration area is down so I can't post to the used equipment section. We have a Fuji GSP-II-4000, S/N 1723, December 1993 for sale. This machine was barely used on a military project that
Electronics Forum | Tue Feb 09 10:16:15 EST 1999 | Jim Gleason
Earl, We have found that many people get closer to a zero defect program using pallets. Since you eliminate manula masking you eliminate on huge area of possible defects production. Since the pallets can align connectors etc, you get less defects due
Electronics Forum | Thu Feb 04 15:44:04 EST 1999 | Michael Allen
Actually, solder paste adds about 12% to the joint volume for PBGAs, or about 31% for MicroBGAs -- assuming standard (recommended) pad sizes and stencil thicknesses, and paste with 90% metal content (50% metal by volume). | | I'd like to find some t
Electronics Forum | Tue Feb 02 08:37:32 EST 1999 | Chris G.
| Hello Everybody: | | I am in urgent need of some information regarding the reflow profile for a flip chip wafer. Would the reflow conditions along with the flux used affect the appearence of the solder joints. | | We are witnessing dull solder j
Electronics Forum | Tue Jan 12 00:33:30 EST 1999 | Jason
| | Our company is beginning to delve into some 20 mil applications and I'm curious to hear what kind of success others have had placing these components. What kind of fall out rates we might expect or any specific difficulties encountered and what
Electronics Forum | Fri Jan 08 10:07:26 EST 1999 | Chrys
| I'm in the process of moving from water washable flux to a full no clean process for the wave soldering process, thing's seem to be going well (so far...). | The one problem I still have is cleaning the wave solder carrier's to remove the no clean
Electronics Forum | Mon Jan 18 19:53:58 EST 1999 | Rob F
| | I'm in the process of moving from water washable flux to a full no clean process for the wave soldering process, thing's seem to be going well (so far...). | | The one problem I still have is cleaning the wave solder carrier's to remove the no cl
Electronics Forum | Tue Dec 29 11:40:24 EST 1998 | Michael Allen
I don't have answers...just comments. We're just starting to assemble CSPs on protos, and I've got the same concerns you have. The MicroBGA package I'm working with has a ball diameter of 0.325mm (0.0128") and a standoff of just 0.010" BEFORE solde
Electronics Forum | Mon Jan 04 23:15:35 EST 1999 | Kris Ewen
Where I worked, we used 0.014" square aperatures (several mfgs. have proven the benefits of square & I've seen a better transfer efficiency myself). Some mfgs use smaller edge lengths & have had success. 0.005" thick stencils give better transfer e
Electronics Forum | Thu Dec 24 01:38:36 EST 1998 | Chris Grendler
I need advice on a pad design which several other engineers whom I work with would like to try. I think it is an utterly crazy but I can't seem to convince them differently. My current 0402 chip pad sizes on alumina and FR4 substrates are .022"X.
