Electronics Forum: after (Page 543 of 696)

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Jul 01 16:57:14 EDT 1999 | JohnW

| | | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | | | Leaching. Dissolution of a metal coating into liqu

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Jul 01 20:56:57 EDT 1999 | Dave F

| | | | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | | | | | Leaching. Dissolution of a metal coating

Re: To clean or not to Clean??

Electronics Forum | Sat May 29 16:56:26 EDT 1999 | Jeff Sanchez

| | I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processing a double-

Re: To clean or not to Clean??

Electronics Forum | Sun May 30 10:15:34 EDT 1999 | Vic Lau

| | | | I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processing a dou

Re: Heatsinks for surface mount devices - adhesive alternative!

Electronics Forum | Tue May 25 10:56:12 EDT 1999 | John Thorup

| | | Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the bo

Re: vibration during solder reflow

Electronics Forum | Mon May 24 09:52:06 EDT 1999 | john thorup

| | | Has anyone had any experience or data using vibration during the reflow process. | | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process

Re: Intrusive reflow..from the bottom..????

Electronics Forum | Fri May 21 15:29:26 EDT 1999 | JohnW

Joe.. Sound's pretty neat trick..mind if I ask what type of comp's are on this board and the paste..? This baby (pig I think) has got a 244pin QFP right dam in the middle..!, so if ur flipin it 180 degree's are u using like a piece of Jot in line co

Re: BGA's - Re-ball -- How thick?

Electronics Forum | Tue May 18 15:36:18 EDT 1999 | Tony

| | | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard micro-stencil,

Re: Cleaning procedures for Entek-Plus Cu-106A

Electronics Forum | Tue Apr 20 16:41:52 EDT 1999 | Justin Medernach

| I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following cr

Re: roll type of cleaning wiper

Electronics Forum | Sun Apr 18 19:18:28 EDT 1999 | Wayne Bracy

| | | | Please visit our Web site, especially 'link page', to get some hint for roll typr of cleaning wiper for automatic screen printers. http://www.squeegee.co.kr | | | | | | | Idiot: I wouldn't visit your site if I had to start using toilet pap


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