Electronics Forum: pass (Page 55 of 142)

Re: Soldering Researcg Question

Electronics Forum | Tue Mar 02 23:08:54 EST 1999 | Marsellus Wallace

Hello, I'm doing some research for a project of mine. I figured that since you sold things related to soldering, you might know. I am wondering if there are any companies that you know of that do manual soldering while st

Good Solder Joint Failures

Electronics Forum | Mon Feb 15 15:43:06 EST 1999 | Dave Jurena

Hope some of you out there can help me with this one. I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they do

Re: Print Height Variation

Electronics Forum | Fri Feb 12 19:02:21 EST 1999 | Jon Medernach

As the squeegee shears the paste at the face of the stencil the vehicle used to contain the solder spheres compresses and expands out the top of the opening after the squeegee passes. This is 1 or 2 mil at most. The peaks should not be considered

white residue

Electronics Forum | Wed Jan 27 19:42:34 EST 1999 | parag palshikar

i am working with the noclean process and getting white residues on the bottomside of the board probably due to the wave soldering flux.i am using a no-clean solder paste and a noclean wave solder flux.The boards passed the accelerated temperature a

Re: white residue

Electronics Forum | Thu Jan 28 08:42:43 EST 1999 | Dave F

i am working with the noclean process and getting white residues on the bottomside of the board probably due to the wave soldering flux.i am using a no-clean solder paste and a noclean wave solder flux.The boards passed the accelerated temperatu

Re: BTU Delta 10 oven

Electronics Forum | Thu Nov 05 17:39:21 EST 1998 | Dave F

Is there anyone who can help me with the average profile to start and speed of the above-mentionned oven ? Have you used the blower at any other setting than 100% use? Barbe: The first pass at setting your profile should be based on: 1 Sol

Re: BGA Singulation Methods?

Electronics Forum | Thu Sep 10 22:33:24 EDT 1998 | S. Evers

At the current time we are scoring and then depanelizing by hand. Can anybody provide info on other techniques for separating parts from the panel? Thanks in advance. Scott C. Something new that got its start in Japan is now being used fo

Pin in hole process problem

Electronics Forum | Tue Jul 28 14:34:47 EDT 1998 | upinder singh

Hello everybody. Remember I posted some questions on the smtnet regarding placing the thru hole connector using paste and reflow(pin in hole). I have able to accomplish the process succcesfully.....but I have a problem. The boards are failing at the

BGA In-circuit Failure Analysis

Electronics Forum | Mon Jun 08 10:45:25 EDT 1998 | Henry Hickey

How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can pres

Entek coating

Electronics Forum | Tue Mar 10 17:56:43 EST 1998 | Jeremy Smith

I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles makin


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