Electronics Forum | Wed Oct 24 18:10:56 EDT 2001 | davef
We attended several presentations on AOI machines at a recent SMTA meeting. The presenters gave a section about process verification. They bantied about numbers. [I want to say 350 DPMO, but we glaze over when it gets to that stuff] So, you might
Electronics Forum | Fri Oct 26 11:34:44 EDT 2001 | pteerink
Paul, Many variables that affect changeover, here's a few to start with: 1) Feeder count- do you have enough feeders to be able to do a complete setup off-line? Take your product that uses the most amount of feeders, and make sure you have at least
Electronics Forum | Thu Dec 06 15:09:14 EST 2001 | smtspecialist
Thanks for the info, Of course the first thing to do was to look with my supplier, but the problem was that it's a special relay, custom made from a design created 10 years ago. Two years ago that company went BK and we had to order a whole bunch t
Electronics Forum | Tue Jan 29 20:14:54 EST 2002 | davef
Please help us understand your situation better by describing the following: * Component [ie, PTH/SMT, type of component, lead finish you expected/ received, etc.] * Board type [ie, type of board FR-4/CEM/ceramic, etc.] * Solderability protection on
Electronics Forum | Wed Jan 30 17:44:38 EST 2002 | davef
The gold is compatible with your solder. Gold will dissolve in your solder very quickly. Assuming you have a fairly large [~ couple hundred pounds] solder pot, the gold will not, over the short term, affect the performance of the pot. The issue is
Electronics Forum | Wed Feb 20 13:23:33 EST 2002 | dgeorge
I have some interesting problems on my hands that some of you may know the answers to. I am currently wave soldering a through hole connector to a rigidized flexible circuit. This is a compliant pin connector that is supposed to be pressed into a h
Electronics Forum | Mon Feb 25 21:09:48 EST 2002 | davef
You are correct about a TCE [CTE] mismatch issues in ceramic packages. The coefficient of thermal expansion [ppm/�C] of major ceramic package elements are: * Silicon - 3 * Standard 92% alumina ceramic � 6.5 * FR4 board � 18-20 Several points are: *
Electronics Forum | Thu Feb 28 16:40:04 EST 2002 | liviuj
>Dear SMTneter, >>I am loonkig for some information about how to rework a >>BGA. >>Some technical info explaing how to put solder past >>manualy, soldering manualy, tips and so on. >>Where can I find something about? >>Thanks in advance >>Marcos Hi
Electronics Forum | Fri Mar 15 17:00:56 EST 2002 | stefwitt
Steve, let me add a more lengthy note on the current service situation, which does not apply for Assembleon alone. I think it was April last year when Nokia re-adjusted their growth rate from 40 % to 10 %. Followed by Motorola�s massive lay off and p
Electronics Forum | Tue Mar 26 23:26:35 EST 2002 | ianchan
Hi Guys, (Note: We are not talking about bill-board RES/CAP, we are talking about Z-axis slant/tilted RES/CAP with respect to the PCB pad Z-axis plane). 1) We ref through the IPC-A-610C specification "bible", and can not find a "chapter/verse" tha
