Electronics Forum | Thu Mar 15 15:36:39 EST 2001 | traviss
Don�t be afraid of the more standard doubles sided mixed process. Even without a chip wave it works, don�t get me wrong it works better with the chip wave, but even without chances are you will be spending more on the additional steps than you would
Electronics Forum | Fri Mar 23 09:28:46 EST 2001 | PeteC
Well, it's hard to say what it started out as, a smear, splash or ball cause the solder formation on the finger after reflow is spread out ya know. I looked at an archive for possible causes and one was printer operators with paste on their fingers.
Electronics Forum | Tue Mar 20 20:12:32 EST 2001 | davef
In response to a similar question Dennis Fritz [DDFRITZ@AOL.COM] Chair of the Alternate Final Finishes Committee of IPC (5-23d) said ... The Alternate Final Finishes Committee of IPC (5-23d) has nearly completed a round robin "conditioning" study of
Electronics Forum | Fri Mar 23 14:13:20 EST 2001 | mnaddra
RW, I have Screened Adhesive on to several different assemblies and have found that when it is possible I get a much better result than with a dot deposition process (The green strength was greatly improved), the biggest issue I ran in to was the pr
Electronics Forum | Wed Mar 28 11:53:50 EST 2001 | Steve
Take the leap of faith my friend!! Buy the AOI and watch all of your problems disappear. Okay, so I exaggerated a bit. Let me tell you the real story. We purchased a CR Technology RTI6500 almost two years ago. We chose the CR Tech unit because it wa
Electronics Forum | Thu Mar 29 10:51:47 EST 2001 | Deon Nungaray
Hello Phil, AOI equipment has been around for a number of years. I remember evaluating a machine around 5 years ago. At this time the system was not able to learn right side up or upside down characters. Well, the newer systems have come a long way.
Electronics Forum | Thu Mar 29 15:29:11 EST 2001 | johnw
measuring Paste volume or at least paste height is an essencial part of any SMT process. You've got to control those input's.... Paste volume determines how much solder is available for your joint so theres a direct to joint reliability / PCB reliabi
Electronics Forum | Fri Apr 13 22:56:02 EDT 2001 | gdstanton
I've been chipping away on a solder bridging and poor fillet wetting problem for a few weeks now (new to the company) and I found two issues. First, after a review of stencil inventory, I found apertures to be oversized when compared to suggested di
Electronics Forum | Mon Nov 27 12:38:10 EST 2000 | rabell
There are a number of issues here. One is having good benchmarks prior to training. Most companies monitor production issues like inventory, scrap, rework, etc. A good ESD program would be performing frequent audits and recording deviations. Hard
Electronics Forum | Thu Oct 26 13:56:08 EDT 2000 | ptvianc
Hello: Pre-baking laminates should only be performed:(1) to meet contractual agreements or (2) in response to an actual defect that can be traced to PWB water absortion. Besides the fact that a pre-bake is an enormous process "bottleneck," it also
