Electronics Forum | Thu Aug 05 09:23:36 EDT 2004 | blnorman
We're using a RC filter network that we're having solderability problems with. There are 4 RC pairs with 2 ground connections (this is a leadless component). The problem we're having is non-wetting of one of the castellations (9 of the 10 scallops
Electronics Forum | Mon Aug 09 20:47:21 EDT 2004 | KEN
I think OA flux left on the pot would quickly looses its activity and become part of the dross waste stream, and smoke stream for that matter. Also, if your wave is setup properly your selective pallets will scour (push) the top of the lambda wav
Electronics Forum | Thu Jan 05 16:39:47 EST 2006 | pjc
Electrovert has a new nozzle design called UltraFill. It was designed specifically for Pb Free applications and generates about 40% less dross than the previous Lambda design. UltraFill can of course be used for Sn/Pb alloys. The name UltraFill is fo
Electronics Forum | Thu Sep 02 10:51:45 EDT 2004 | patrickbruneel
Hi Ken, Thank you for the reply Ken. I hope I don�t get my behind in trouble for subject change in this thread. But you hit the nail on the head in your comment with Hitachi, when they converted to lead-free they had a �5 times higher defect rate� i
Electronics Forum | Tue Aug 31 07:51:28 EDT 2004 | dennispoquiz
I used to do optimization on Panasert MV2F/V,Fuji CP6/4,GSM (Universal),Sanyo TCM 3000 with no problem. My problem now is on my old Sanyo V822 SMT chipshooter. I am working on a multi-block (multi-cavity) PCB panel and i cannot, in any way, mount all
Electronics Forum | Thu Sep 09 04:51:19 EDT 2004 | Simon UK
65%), if one failed on the board i replaced all of them, and re-tested and thermally cycled them inline with our spec (-55/+80 Deg/C for 48hrs) this was a nightmare, especially when some cracks were not detected until several weeks later while flying
Electronics Forum | Tue Sep 14 19:47:16 EDT 2004 | davef
use something other than HASL. "The rest of the world seems to be processing with no problems..." [Hello!!! Earth to Carol. This is a test.] Things you are considering could be more trouble than they�re worth. "1) Reduce via hole size" [If you re
Electronics Forum | Fri Sep 17 09:31:17 EDT 2004 | russ
Step stencils are used but only when necessary. One reason to use one would be a PCB with 12 mil pitch and very large coils or something of that nature. The 12 mil pitch part would require a 4 mil thick stencil to ensure release while it would caus
Electronics Forum | Tue Oct 26 08:41:56 EDT 2004 | Bob R.
When we first got into BGAs on ENIG we were getting joint cracking at in-circuit test. The joints were breaking in the Sn-Ni intermetallic. We did a lot of pull testing while working with our board suppliers and our conclusion was that pull testing
Electronics Forum | Fri Oct 29 09:45:08 EDT 2004 | pioneertechnology
In 1995 we bought 4 Vitronics U520 reflow ovens with top heat only. We ran these ovens until 2003 for both curing and lead reflow with no problems. In 1998 we bought 1 U520 top and bottom heat and one U820 top and bottom heat and once again we had
