Electronics Forum | Wed Jan 20 10:03:10 EST 1999 | Earl Moon
| I need some opinions (And I know everybody has one). | I am mounting a board into a case, after mounting the board | I am loading it with stress in the middle causing it to bend around .030 inch. The board is 4" X 6" and is Bending in the 4" dire
Electronics Forum | Wed Jan 20 14:21:54 EST 1999 | Dave F
| I need some opinions (And I know everybody has one). | I am mounting a board into a case, after mounting the board | I am loading it with stress in the middle causing it to bend around .030 inch. The board is 4" X 6" and is Bending in the 4" dire
Electronics Forum | Fri Jan 15 13:35:03 EST 1999 | Terry Burnette
| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat
Electronics Forum | Thu Jan 14 22:59:08 EST 1999 | Chris G.
I get white residue on my PCBs after vapor degreasing. No comments on the vapor degreaser. Yes, I still use one of these. I use a vapor degreaser and a 1,1,1 replacement solvent due to the quick clean and quick dry times. Anyway, I only get white
Electronics Forum | Mon Jan 18 21:05:15 EST 1999 | Dave F
| I get white residue on my PCBs after vapor degreasing. No comments on the vapor degreaser. Yes, I still use one of these. I use a vapor degreaser and a 1,1,1 replacement solvent due to the quick clean and quick dry times. Anyway, I only get whi
Electronics Forum | Mon Jan 04 11:59:41 EST 1999 | Steve Evers
| Give me your opinions and experiences of SelectX, selective debridging system in the Vitronics Soltec wave soldering machines. | Opinion and (food for thought)?: First let me say that I am not familiar with SelectX. In the past, manufacturing e
Electronics Forum | Tue Dec 29 11:40:24 EST 1998 | Michael Allen
I don't have answers...just comments. We're just starting to assemble CSPs on protos, and I've got the same concerns you have. The MicroBGA package I'm working with has a ball diameter of 0.325mm (0.0128") and a standoff of just 0.010" BEFORE solde
Electronics Forum | Mon Dec 28 15:03:14 EST 1998 | Earl Moon
| We have a Vitronics SMR400N oven and many times need to use N2 inerting. My problem is that it takes close to an hour of operation to purge the system to achieve the desired O2 levels (~40PPM). This is not only time consuming but results in an inor
Electronics Forum | Thu Dec 24 01:38:36 EST 1998 | Chris Grendler
I need advice on a pad design which several other engineers whom I work with would like to try. I think it is an utterly crazy but I can't seem to convince them differently. My current 0402 chip pad sizes on alumina and FR4 substrates are .022"X.
Electronics Forum | Tue Dec 01 10:25:54 EST 1998 | Earl Moon
| | | All y'll: I could use your input on determining when to skim dross from a wave solder pot. | | | | | | On one hand, dross protects the surface of the solder from oxidation. On the other hand too much dross may affect solder joint quality. O
