Electronics Forum | Mon Oct 24 13:29:49 EDT 2022 | furman
Poland
Electronics Forum | Thu Nov 10 17:48:52 EST 2022 | furman
Where are you located? Still interested?
Electronics Forum | Thu Jul 15 09:34:24 EDT 1999 | John Sims
I'm looking into vision inspection equipment to automatically inspect SMD placement and solder joint quality. Does anyone have any recommendations or know of any commonly used equipment? Do other manufacturers use vision systems at their inspection
Electronics Forum | Fri Sep 07 11:59:10 EDT 2001 | Carol Stirling
Could someone recommend the pressure for cleaning PWBs after reflow please? Also, if there is a wash system you find satisfactory, the name, phone and location would be appreciated. Thanks in advance for the help. Carol (Excuse the typo in the Thre
Electronics Forum | Wed Mar 20 06:20:18 EST 2002 | hany_khoga
Thanks Dave for this contribution. After a lot of discussions with colleagues I found a general tendency to use the air hand tool. Could you please send us detailed steps of using those air guns, considering the distance between the gun & the PCB, t
Electronics Forum | Tue Apr 06 11:17:01 EDT 2004 | ccl
hi, i encounter gold surface contam issue on wire bonding ring after prebake at 150 C for 3 hrs, tis cause wire bonding non stick issue. the contam seem begin at the solder mask area toward center of the bonding ring, but is not consistance.
Electronics Forum | Tue Apr 06 17:01:24 EDT 2004 | davef
It doesn't make sense that contamination would form on your gold pads after prebake of 150C for 3 hrs. The contamination must have been there prior to the bake. Your description makes us think of solder mask bleed. Tell us about: * Solder mask * S
Electronics Forum | Wed Jul 20 16:51:48 EDT 2005 | Pete Roy
My Dek printer "forgets" the speed setting after a few passes and reverts to a faster speed thus screwing up the print. If you edit and change the programmed value and save it, all remains find kind of like refreshing the memory. Any suggestions, I
Electronics Forum | Thu Sep 15 17:55:18 EDT 2005 | slthomas
Are they worried about the top side SMDs too, or just the bottom side? If it's just the bottom, maybe you can just glue them without reflowing. That way they won't be at risk of cracked solder fillets after AI. Granted, you'll probably be glueing pa
Electronics Forum | Tue Feb 11 12:02:52 EST 2014 | javierec
Process: Batch Cleaner, @16% concentration. Concentration is checked daily. Cleaning after Wave Process. See attached pictures and comment and what you think causes the solder joint to turn grey. i have read post that say the grey dull looking sol
