Electronics Forum | Wed Aug 08 15:31:30 EDT 2001 | johnw
Hi folk's, I'm looking for some hint's here. Got a board from the customner that is ceramic, and it's 2.2mm thick. I've got a couple of RF connectors that I need to solder, problem is I can't get any flow up the PTH's. The pin's are gold on the conn
Electronics Forum | Wed Aug 15 16:14:22 EDT 2001 | davef
Comparative Tracking Index [CTI]. In printed circuit board fabrication, CTI is a measure of the ability of the laminate surface to withstand tracking [carbonneous tracks on the surface, under wet contaminated conditions] across two electrodes placed
Electronics Forum | Fri Aug 10 13:28:19 EDT 2001 | Hussman
Hey John, You're not alone, a lot of people have the same problem with different machines and material. What is your specific problem, just keeping SPC control? Or are your defects at the wave from the glue too? If it's a process problem, I found
Electronics Forum | Thu Aug 16 20:11:21 EDT 2001 | davef
Hussman is correct. Make those people quit. [Just walk-up, pimp slap 'em, grab their dental pick, and say "Dave says you can't use this any more. I'm just following orders."][Trust me, this is much smoother than the "Tonya Harding Approach" that I
Electronics Forum | Fri Oct 05 07:46:24 EDT 2001 | george
Specifications of testing force are not fixed, but (incase of wave soldering) the value should be at least 120-150 % of the force the wave. So for small chip components we assume that the force from the wave on the component is about 3 Newton, this m
Electronics Forum | Wed Sep 05 08:50:04 EDT 2001 | davef
No arument with others comments about moisture, but taking a different tact, consider that the volitle elements of the solder paste disppear as a function of the amount of time the paste is out of the container. [Maybe as a function of solder paste
Electronics Forum | Wed Sep 19 09:34:08 EDT 2001 | jschake
Both FormFlex and Grid-lok tooling systems are marketed as compliant tooling systems. Both are able to conform to the variations of the topography on the bottomside of a substrate to provide full support during printing of 2nd side assembly. The ba
Electronics Forum | Fri Sep 21 14:03:45 EDT 2001 | jschake
I have observed solder balling for all aperture sizes tested. Solder balling levels appear to be better correlated against the amount of solder paste that is underneath the 0201 component terminations after placement rather than comparing this to th
Electronics Forum | Thu Oct 11 17:44:30 EDT 2001 | aaelect
OK, OK. 672 ball BGA. The pcbs are PC Card bus size and are .015 thick. There are 3 on a panel with about 1/2" between and rails. The aluminum plates are about 3" by 7". There are 3 cutouts which allow for the parts from either side to protrude du
Electronics Forum | Tue Oct 16 06:08:12 EDT 2001 | wbu
Hi Dave, tweaking, oh yes, we did like it to have that job done and not have people sitting around waiting for work or beeing able to deliver on schedule. Nonconformity report, ...ummmmh, weren�t that big that we thought we needed it, actually the t
