Electronics Forum | Thu Sep 15 17:55:18 EDT 2005 | slthomas
Are they worried about the top side SMDs too, or just the bottom side? If it's just the bottom, maybe you can just glue them without reflowing. That way they won't be at risk of cracked solder fillets after AI. Granted, you'll probably be glueing pa
Electronics Forum | Tue Feb 11 12:02:52 EST 2014 | javierec
Process: Batch Cleaner, @16% concentration. Concentration is checked daily. Cleaning after Wave Process. See attached pictures and comment and what you think causes the solder joint to turn grey. i have read post that say the grey dull looking sol
Electronics Forum | Wed Jun 15 02:09:50 EDT 2016 | twhoo
Anybody see this kind of reject. The thru hole ring turns black (certain area) after wave soldering. The affected area cannot be soldered. Manual touh up is also not possible. Anybody what is the cause of this? Any lab test to prove what is the ite
Electronics Forum | Fri Feb 09 13:28:24 EST 2018 | jmedernach
Pin holes in the solder joints on various devices can be an indicator of something amiss with the solder paste itself. Solder paste storage may be a concern. Do you possibly have someone putting paste back in the refrigerator after use? Are you tr
Electronics Forum | Wed Apr 11 17:00:28 EDT 2012 | rodrigo
Hi all, Our cp4 moves rather violently (jerks) all axis when the reset sw is pressed after power up. I've got all sorts of errors after boot up: Servo amp error: D,X,Y, etc Overtravel D,X,Y, etc D clutch error, power off machine We've checked all
Electronics Forum | Mon Dec 25 08:43:35 EST 2017 | arjunkolavara
Hi , We are having Pin hole issues on the passive locations in the board after the SMT reflow process. Details: PCB surface Finish : ENIG . Solder paste : Alpha OM338 – M13 / Indium SMQ92J Location : Its Random and more on passive components. {
Electronics Forum | Thu Sep 15 17:44:15 EDT 2022 | decaire
I agree with Evtimov that sticking with the J-Std-033 is preferable to creating your own procedure at a different temp, especially if you need to pass an audit since the auditors will compare your process to the J-Std. My understanding is that oxida
Electronics Forum | Thu Sep 15 17:39:08 EDT 2005 | stepheniii
I just wanted to add I'm not saying there is no egineering aspect to this, just that it sounds like it is more to do with your customers perceptions. Ask why they think it could be a problem. Maybe they have had previous experience with it before. I
Electronics Forum | Thu Sep 15 22:12:08 EDT 2005 | LeeHoMa
hi Steve, In fact, I am not so sure which side will have bigger chance to get problem(from my current pilot run, the defect is nearly zero). Top(componet side) or Bottom(Soldering side)? And what is the reason? Customer do not mentioned clearly wha
Electronics Forum | Thu Oct 27 00:45:41 EDT 2005 | pavel_murtishev
Good morning, I can recommend to use solder paste softeners, which can prepare solder paste for printing process. Softeners rise paste temperature by means of pseudo-planetary motion. Therefore, solder paste reaches room temperature during only 15
