Electronics Forum: contains (Page 60 of 83)

Re: Tombstone

Electronics Forum | Tue Sep 14 10:54:37 EDT 1999 | Scott Davies

| Can anyone out there pls enlighten me on how to solve chip tombstone defects. | I am running a board with a lot of 0603 chip. i had fine the profile and the alignment, but it still happen randomly on the board itself. Is there any other way to sol

Re: CEERIS Benchmarking Studies

Electronics Forum | Fri Aug 20 09:51:44 EDT 1999 | Dave J

| | CEERIS has been sending me flyers for some time, touting the value of their various studies and insights gained from digesting the facts contained within. The topics are indeed of great interest. My question is to whomever of you has purchased on

Re: Parts Packaging Data

Electronics Forum | Thu Aug 05 04:32:21 EDT 1999 | Wolfgang Busko

| I am currently in the process of setting up an SMD Parts Package Database. The database will contain dimensional information to be used by the placement machinery to process parts (I.E Package Type, # of Leads, Lead dimensions, Lead pitch(s), etc.

Re: Parts Packaging Data

Electronics Forum | Thu Aug 05 15:26:42 EDT 1999 | Brian E. Steelglove

| | I am currently in the process of setting up an SMD Parts Package Database. The database will contain dimensional information to be used by the placement machinery to process parts (I.E Package Type, # of Leads, Lead dimensions, Lead pitch(s), etc

Re: handling components for rework

Electronics Forum | Mon Jul 26 18:03:45 EDT 1999 | John Thorup

| We only do rework with SMT components or a small amount of SMT work. We are having a hard time keeping the components safe throughout the handling process of removing one or two components, and issuing them to an operator for processing or inspect

Re: Solder Paste from 500 gram tubes.

Electronics Forum | Tue Jul 20 09:20:39 EDT 1999 | Dave F

| I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk paste

Re: Solder Paste from 500 gram tubes.

Electronics Forum | Wed Jul 21 01:24:06 EDT 1999 | Scott McKee

| I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk paste

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Jul 01 16:43:52 EDT 1999 | Dave F

| | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | Leaching. Dissolution of a metal coating into liquid solder.

Re: Repair of SMT boards

Electronics Forum | Sat Jun 05 07:23:20 EDT 1999 | Dave F

| Where I can find some informations about repairing of SMT boards? | | Thanks | | Marcos | Marcos: Ya know, repair is that "dirty little" part of the business that all try to ignore, don't want to fund properly, and creats more angst than propa

HELP! Plating issue on chassis

Electronics Forum | Fri May 21 12:24:21 EDT 1999 | KA Stillings

I normally handle the soldering issues for this facility but a question was asked of me -- What the H@## is this stuff and what is causing it? Was wondering of I could get some input from any Guru on plating issues. Need info ASAP!!!!!!!!!!!!!!!!!!!


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