Electronics Forum: pass (Page 61 of 150)

Re: SMT information required

Electronics Forum | Wed Feb 18 13:47:55 EST 1998 | Phil Szypko

| I am currently researching SMT for an essay which | counts towards my Elec Eng degree course. | Unfortunately the deadline is Friday 20th Feb and | as yet I have found little information on which to | base my essay as other students have loaned out

Solder Joint Strength on Fine Pitch

Electronics Forum | Wed Aug 15 21:56:53 EDT 2001 | hardy boy

Our R&D Guys used to push the lead of a fine pitch component using a Pick or a thin metal tip and if the lead snapped off from the land it's considered failed. Is that the proper way of identifying the solder joint strength? We got problems with sold

DPMO calc and Overall Manufacturing Index (OMI) calculations

Electronics Forum | Mon Aug 27 19:24:00 EDT 2001 | sharafali

It has been mentioned that DPMO offers large advantages over First Pass yield calculations for measuring process performance!!regarding the same I have a few queries: What are the benchmarks for using DPMO as measures of process performance? How is

Need Quad 100 chuck Size 00-01XG new or used

Electronics Forum | Thu Aug 30 21:25:37 EDT 2001 | davef

Oooo, nice machine. For chuck repair, try: Mt Sterling Industries POBox 670 Mt Sterling KY 40353 606.498.1015fax4156. This is not rocket science. A local machine shop could probably do just as nice of a job. For newer chucks, try the brokers list

Missing componentafter chip placer.

Electronics Forum | Sun Sep 09 14:34:50 EDT 2001 | darburch

Eric Whenever I see a board come out of the chipshooter missing parts the first thing to check is the support pins. However if you have checked table and part height I assume that you have also checked the pins. So the next thing to check is the vac

Which side of PCB should be prefered for screening...

Electronics Forum | Tue Sep 18 01:41:23 EDT 2001 | shvetangcd

Hi Jeff, We are having solder-short problems for BGA, QFP, and some other fine pitch parts while using DEK screen printers. The PCB is processed on the second half of the line for screening the side with BGA, QFP, and other fine pitch parts. Which m

Flat Solderable Tin as a PWB solderable surface finish

Electronics Forum | Fri Nov 16 10:53:30 EST 2001 | Carol Stirling

Hello Everyone, Our board supplier changed our board surface finish on a prototype to flat solderable tin (FST) because of the PWB thickness (.125"). The pads seem to be contaminated, particularly on second side pass through reflow. The solder appea

Hand Lotions

Electronics Forum | Wed Mar 20 15:17:38 EST 2002 | MikeF

I understand your point, and generally agree with you about no lotions in the production area. My question for you and the others is what to do with the person whose skin is so dry it does not make good contact with their ESD wristband? I do not li

Working Paste Before Printing

Electronics Forum | Wed Mar 20 11:55:19 EST 2002 | slthomas

Interesting. Ours failed miserably. Of course we toss everything on the stencil at the end of a shift (they are instructed to let it run down to minimal volume on the stencil as they approach quitting time) so it's not an issue. We are more concer

Any comments for Quality @ AQL=0.1, C=0 ???

Electronics Forum | Fri Mar 22 21:31:25 EST 2002 | ianchan

Hi Guys, Anyone have "comments/testimony" on having possible quality level achievements, for AQL=0.1, C=0 ??? Is this a realistic "1st Pass Yield" expectation? how about for OQC submission Lots from production? especially in a high-mix, low-volu


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