Electronics Forum | Fri Aug 20 16:05:35 EDT 1999 | Earl Moon
| | OK folks, let's get real serious. | | | | Well, I shot off my big mouth yesterday during a scheduling meeting concerning DFM and rework. Again, what an irony, oxymoron, or that other thing. | | | | Anyway, I said it would take another 4 weeks t
Electronics Forum | Tue Jul 27 17:47:36 EDT 1999 | Earl Moon
| While inspecting incoming PCBs we detected around all plated-through-holes (only there and all in the same place) some halfmoonshaped light rings that match obviously only with the pink ring symptom shown in the IPC-A-600 chapter 2.5.2.. That would
Electronics Forum | Sat Jul 24 10:20:15 EDT 1999 | Bob Willis
PCB Solder Finishes Survey Questions 1999 Results for the 1996-7 survey are located at www.smartgroup.org As a number of SMART people have requested an update on the solder finishes survey SMART Group have run in the past here is your opportunity t
Electronics Forum | Tue Jul 20 10:08:30 EDT 1999 | Wolfgang Busko
| | I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk pas
Electronics Forum | Tue Jul 13 13:51:51 EDT 1999 | Earl Moon
| | | Hi all , | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | 2. What type of stencil apertures are t
Electronics Forum | Thu Jun 24 23:52:36 EDT 1999 | Dean
| | | Dear guys, | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We
Electronics Forum | Thu Jun 17 21:24:32 EDT 1999 | Dean
| first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an
Electronics Forum | Wed Jun 16 06:16:44 EDT 1999 | Brian
I'm sorry, Cliff, but what you say is akin to bovine excrement. The problem is that your server is shared and is in Fort Lauderdale, which is at the end of a spur from one of the Atlanta nodes of the Internet backbone. The available bandwidth on this
Electronics Forum | Sat Jun 12 08:50:41 EDT 1999 | Dave F
| I am trying to find out as much information as possible relating to conductive inks. | | If anyone out there is using them please give some advice. | | 1) How are you curing the ink? | 2) What type of substrates are you using and who supplies
Electronics Forum | Tue Jun 08 12:49:41 EDT 1999 | Dave F
| Hi,my master | How to iron out such soldering bridge with below conditions: | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | 3.using spraying fluxer and n
