Electronics Forum | Wed Feb 26 10:57:47 EST 2003 | larryk
Dave, I had to contact Circuits Assembly, but I got the article. I'm going to forward it on to Ryan. I think you're on to his problem with flux becoming entrapped in the epoxy. It plays along with Locktites suggestion of a longer soak on his profile.
Electronics Forum | Thu Jun 26 04:34:49 EDT 2003 | emeto
Hi James, I saw very good posts here.Now I will give you one more practical way: 1. My advice is to encrease the temperature(like your first sidgestion). Termostress is important thing so your first zone should be 120-150C. 2. The paste profile. If
Electronics Forum | Thu Jan 29 18:01:20 EST 2004 | davef
Rethinking to Ramp / Soak: Yano, staying with ramp might not be all that bad after all, just decrease the ramp / slow-down the conveyor.
Electronics Forum | Wed Mar 24 08:37:32 EST 2004 | steveliu
Hi, Guys, Can anybody tell me what kind of reflow profile is best for a no clean solder paste: Ramp-Soak-Spike or Ramp-to Spike? The paste we are using is AIM 293DX2B. Thanks a lot.
Electronics Forum | Wed Mar 24 16:28:06 EST 2004 | davef
No-clean flux residues can be either cleanable or not cleanable. The not cleanable type leave a milky white residue on the solder connection after suitable soaking in water. Your flux supplier will have suggestions on the appropriate flux.
Electronics Forum | Fri Jul 02 11:17:09 EDT 2004 | jdumont
I agree, the flux will probably burn off before it gets to do its job. Def not a good idea....
Electronics Forum | Fri Jul 02 14:15:42 EDT 2004 | bcceng
X-RAY, X-RAY and X-RAY.. to optimize your reflow process when using BGA's you have to use your reflow profile hand to hand with your x-ray process.
Electronics Forum | Sat Jul 03 11:10:48 EDT 2004 | KEN
??? Two assemblies assembled under the same conditions with identical x-ray results can have dramatically different life expectencies. Operating environments will have a direct affect on the product ie. hunidity, temperature swing, temp. duration, v
Electronics Forum | Mon Jul 05 03:53:36 EDT 2004 | johnwnz
Hey, this is something that I've looked at and published a paper on back in 2003 at Apex, actually pert of one, the other part was lookign at how effective X-ray systems (lamanography systems) were at detecting & measuring BGA void size accuratly (co
Electronics Forum | Fri Jul 23 08:59:27 EDT 2004 | davef
For reflow, low soak time and low peak temperatures will help reduce the number of components skewing Search the fine SMTnet Archives. For instance: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=6071&mc=15
