Electronics Forum | Thu Jan 11 19:53:58 EST 2007 | asbok...
Why don't you just use a Super MOLE oven rider? And besides, profiling will depends on the paste you are using, isn't that right?
Electronics Forum | Tue May 13 07:40:14 EDT 2014 | sarason
There are many alloys of silver solder for higher temperatures mostly used in plumbing There are also alloys which are available in paste form used in the manufacture of hybrids. sarason
Electronics Forum | Wed Dec 20 23:29:32 EST 2006 | Jack
Hi all, Is there anyone know the correct way to obtain the accurate temperature profiling for oven reflow? Are below claims true? (1) Instead of full components on the PCBA (Motherboard), the profile taken from PCBA with few components can be cons
Electronics Forum | Fri Jan 03 08:19:24 EST 2003 | emeto
hi, for more info try one of these if you missed some: http://www.amkor.com/ http://ap.pennnet.com/ http://www.asymtek.com http://www.smta.org/ http://www.semiconductor.net/ http://www.smtinfocus.com/ http://www.elis.rug.ac.be/ http://www.kns.com
Electronics Forum | Fri Jan 03 16:14:37 EST 2003 | Jacques Coderre
Hi Jon, Flip Chip is chosen as an interconnect approach when one needs improved performance (high pin count, high frequency, noise reduction or improved heat dissipation.Another driver is size...Flip Chip greatly reduces the area and therefore is cho
Electronics Forum | Tue Jan 09 10:13:40 EST 2007 | slthomas
You could probably make do with two as long as you attach to the smallest part in a sparsely populated area and a large heavy part in a densely populated area to cover both ends of the spectrum. When I had a MOLE I used all 6. Now I use the 3 the ove
Electronics Forum | Wed Jan 10 17:11:53 EST 2007 | mscalzo3
I always try to profile using a fully populated board and soldering the thermocouples. This is the only true way of getting an actual temperature of the joints. But, with that being said, its not always feasible to use this. There have been a coup
Electronics Forum | Sat Mar 15 20:24:13 EST 2003 | ramanandkini
Thanks Mr.Dave. Sorry for the delay. One of our major prolems in ENIG plated surface is that wire does not stick. For many years we were getting a bond strength of 14 grams in both ENIG and electroplated surfaces. Now one vendor supplies ENIG boards
Electronics Forum | Sun Mar 02 17:40:02 EST 2003 | MA/NY DDave
Hi It sounds like you are in a different country or in the USA a long time ago. I have no idea of the process either is using, so they can be comparable or one can be better than another and lop sided compared to other places. Benchmarking I think
Electronics Forum | Thu Dec 21 02:27:57 EST 2006 | pavel_murtishev
Good morning, (1) This depends on component type. In general it would be better to have fully populated board. Or at least you should mount components with different thermal mass. You should place TC�s at three points at least: component with high t
