Electronics Forum: contains (Page 62 of 81)

Wrong Part

Electronics Forum | Mon Apr 01 17:50:31 EST 2002 | stefwitt

the good and bad days are normal results of statistics. You enter some variables like number of feeders, length of part numbers, day of the week, sexual satisfaction of the operator a.s.f. , you get some statistical distribution. It tells us that on

Nitrogen Storage

Electronics Forum | Wed May 15 13:11:26 EDT 2002 | fmonette

Hi Dason, Yes I was talking about the same paper. This is the best technical information available to clearly explain the physics of moisture diffusion inside a plastic package. Many of the guidelines contained in the current J-STD-033 are derived

Temporary Stencil for MPC555 PBGA

Electronics Forum | Thu May 30 13:46:00 EDT 2002 | davef

Consider NOT getting involved in those little POS chunks of sheet metal. * They're expensive. * You never have the one you need. * Even if you DO have the item you need, you probably will not be able to locate it. * It's all but impossible to c

BGA Assembly

Electronics Forum | Thu May 30 10:59:41 EDT 2002 | Hussman69

Diamond/sqaure shapes are good for when you X-Ray the BGA as stated above. The only problem is if you you over print too much, you can get solder beading. I recommend round pads to avoid the beading and use X-Ray to make sure you reflow correctly.

gold connectors

Electronics Forum | Fri May 31 17:04:02 EDT 2002 | davef

We use boots / shunts er wutt ever you call them to protect solderable component surfaces from wave soldering. Not sure how it would work in your case try: * Kinnarney Rubber 450 Main St. P.O.Box 37 Mantua, N.J. 08051 609-468-1320 fax 7438 http://ww

Remove,Re-ball then Re-use BGA safely !!!

Electronics Forum | Tue Jul 02 12:10:06 EDT 2002 | fmonette

Dason, Just a word of caution about your experiment. Evaluating moisture content by weight gain is a very simplistic model, based on the assumption that the moisture content is uniform across the package. In fact, recent technical papers have cl

imm. silver

Electronics Forum | Sun Sep 08 19:58:57 EDT 2002 | dasal

My specialty. Your right, Most corrugated contains S02 and the pallet is usually out gassing formic acid as well. Not a great environment for silver. Original press release follows: Reactive Polymers At AT&T Bell Labs, John P. Franey has developed

0603 - stencil thickness

Electronics Forum | Sat Jan 04 09:02:17 EST 2003 | davef

Q1. What is the recommended stencil thickness to apply the proper amount of solder for 0603 components? A1. The proper amount of solder is determined by: * Metal content of the solder paste. * Stencil thickness. * Aperture opening. * Other factors,

Black pad defect

Electronics Forum | Tue Feb 11 22:28:25 EST 2003 | davef

What do you mean by "new information"? On final module testing: * If you have hypercorroded nickel and you detect it during final testing, you'll notice it. * If you have hypercorroded nickel and you don't detect it during final testing, you'll ship

Use and Restrictions of solder containing lead

Electronics Forum | Thu May 29 17:48:00 EDT 2003 | jonfox

As far as I know, the limitations apply to to the manufacturing components, not the equipment per say. At this point there is no set date for the US at the national level. Basically our government is run by big businesses and their effect on our na


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