Electronics Forum | Tue Apr 09 00:09:25 EDT 2002 | craigj
Question. When profiling and looking at the profiles cooling rate. Over what temperature range should the slope be monitored and what sort of cooling rates should be looked for. Paste supplier says no more than 6degC per sec, some components maybe lo
Electronics Forum | Sat Sep 27 13:12:37 EDT 2014 | gascon5383
I have a situation and was hoping to get some opinions on whether a saddle type profile is better or worse than a linear profile. We have an 8 heating zone 3 peak zone and 4 cooling zone single track oven that I am having a tombstone issue with. It's
Electronics Forum | Wed Sep 11 13:20:37 EDT 2002 | stepheno
I've seen this problem caused by the cool down. On a 7 zone oven I made a profile to peak at zone 5 to give some semblance of control to the cool down. The component can develope a big delta T, because of the difference of materials
Electronics Forum | Sat Sep 25 10:36:06 EDT 2004 | gpaelmo
Hi, Anyone using this in production? Our company is looking into this model (used). Board size up to to 8"x10", max layer=12, single and double side SMT, medium density mostly passives, max QFP/BGA on board=7-10, 1,000-3,000 boards/wk. Can anyone d
Electronics Forum | Tue Nov 14 19:59:22 EST 2006 | wchang
Heller 1800S Convection Reflow �� 1996 - 97 vintage �� Dimensions: length 150��, width 53", height 63", �� Number of forced convection zones - top 9, bottom 8 �� Cooling zones: 2 �� Conveyor width (m
Electronics Forum | Fri Dec 15 01:37:21 EST 2006 | shrikant_borkar
Hi, Hemendra Recently, We have carried out lead Free Soldering On our 4+1 Panasonic Reflow machine. Results were fine , but its Not Recommended for long Run. but the machine which you have is 5 zone machine and additional 2 cooling zone too. Check
Electronics Forum | Tue Oct 16 06:41:22 EDT 2007 | aj
Hi All, I understand that reflow Profiles are Product dependant but I would like to compare my profiles to what others are doing. Any input is greatly appreciated. I have a 5 zone Oven + 2 cooling Zones. ( Leadfree) If I could get some answers to
Electronics Forum | Sun Jul 13 10:33:08 EDT 2008 | mpolak
Hello, Recently I have change our profiles. After I profile one board it look really good, within the paste spec. But I have noticed when board leaves the reflow zone and enters the cooling zone it looks like popcorn effect some components jumping o
Electronics Forum | Thu Apr 07 11:39:48 EDT 2011 | remullis
My oven profile is 155,160,165,180,220,245,255,227 Cooling Zone 132/92. This is a 8 zone CV820 Technical Devices oven. My assy profile using Datapaq Q18 - Base on one probe feedback - Positive slope (7.09), Pos Slope Time (.45), Rise Time (1.17), Me
Electronics Forum | Sat Aug 12 11:55:52 EDT 2017 | sankarseptember
We are facing component Drop on second side of the reflow.We are using Senju Reflow oven..Profile judgement was within in the standard.All the component Drop occur in between last heating zone and cooling Zone.The dropped component is ICC 525FL5 SOP
