Electronics Forum | Sun Aug 27 06:32:24 EDT 2006 | mika
Many Thanks to You all. I think we should be ok with the majorty of our cap's if we set the comp. thicknes to 0.2 mm less than the actual size to be able to compensate for the variable thicknes from different wendors for a certain component. Do You
Electronics Forum | Fri Dec 15 03:16:11 EST 2006 | pavel_murtishev
Good morning, The critical points for successful PIP technology are: 1. Gap between THT lead and PHT hole. It shouldn�t be greater that 0.2mm; 2. Lead shape. THT leads MUST be straight or you�ll get excessive voiding otherwise; 3. As Russ said, pas
Electronics Forum | Fri Apr 06 16:36:39 EDT 2007 | mika
Ah, I almost forget (forgot?) to mention that according to the Gerber files (which is the info we send to the PCB-house) the PCB land pattern for this LGA-36 0.35mm rounded pads and the boardhouse cannot achieve this. I understand them; 0.35mm pads,
Electronics Forum | Tue Oct 07 09:40:44 EDT 2008 | john_smith
Dear, Flexkhushi Do you mean 2 mm thick board or .2 mm board. If you are talking .2mm then you are refering to a flex circuit correct? What equipment will you be using to place the 01005 component? I
Electronics Forum | Mon Mar 22 07:40:01 EDT 2010 | emanuel
Are you absolutely sure the problem is with the humidity? We had a problem with 3528 size leds, damaged by the pick and place nozzle because a 0.2mm mistake in the height measurement. Also, we found that several suppliers are using fake desiccant ba
Electronics Forum | Mon Aug 16 14:43:44 EDT 2010 | dan_ems
Hello, i don't know if is possible to dispense paste but for reduction of cost we use a diferent type of stencils, from aluminium of 0,2 mm, purchased from a typography of newspapers. Ofcourse the pcb for what we use this stencil are simple. But th
Electronics Forum | Tue Dec 28 03:59:06 EST 2010 | riscy00
I'm investigating heat transfer by 1st order approximation between PCB and ambient air via encapsulate material (epoxy or gel or silicone), they have thermal conductivity of 0.2W/C but it hard to find specific heat capacity and density. Has anyone
Electronics Forum | Fri Dec 27 16:12:54 EST 2019 | anteiv
thank you for reply here is picture of the board https://imgur.com/a/i2MfFBw on the bottom are pins/components which height is about 3-4 mm from bottom of the board we had to increase distance of board from nozzle to make clearance and we increas
Electronics Forum | Fri Sep 11 15:58:50 EDT 2020 | majdi4
You haven't communicated what thickness of stencil you are working with ... it's interesting to know..at first, you need to reduce the amount of CAB deposited because with 1X1 stencil aperture size you are depositing an amount important CAB .. so, I
Electronics Forum | Wed Nov 02 11:01:56 EDT 2022 | tommy_magyar
Ellaborating on Evtimov's answer: - solder paste type, think about solder granulation and viscosity. Both of these will directly affect print quality if wrong print parameters used. You will normally find recommended print parameters on the solder pa
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