Electronics Forum | Fri Dec 16 04:41:30 EST 2005 | tk380514
A day and half is a life time for our solder paste, Almit V14L... but then we dont have in-line solder paste printers, we have micro BGA stencil that wont work with anything but new solder paste, 0.8mm pitch and pad size is 0.3mm, stencil thickness
Electronics Forum | Mon Feb 21 17:56:44 EST 2005 | davef
You want approximately 5 particles minimum across the smallest aperture. So in the case of a 0.8mm device, we use .017" pads with a round 0.020" aperture on a 6 thou thick stencil foils. Here, 0.020" diameter equals 0.50mm. This gives us 0.50/5=10
Electronics Forum | Fri Feb 11 02:42:17 EST 2005 | marakas
Thank you very much for your answer. We had: 1- 224 pins, size 19*19 mm, pitch 0.8 mm 4- 48 pins, size 11*7 mm, pitch 0.75 mm 1- 160 pins, size 15*15 mm, pitch 1 mm 1- 196 pins, size 15*15 mm, pitch 1 mm How many defects I should expect with th
Electronics Forum | Wed Aug 31 09:06:11 EDT 2005 | PWH
Agree with Siverts. We do a build that has 0.3mm pad diamter BGA (0.8mm pitch - distance from pad center to pad center) and 0.5mm dia. BGA balls. Stencil specs. are: 5 mil. thickness, square BGA pad aps. (1:1, 0.3mm square aps), laser cut. Seems
Electronics Forum | Thu Jun 13 11:25:40 EDT 2002 | davef
Help us understand your situation by telling us about: * Is this a terminal-to-terminal short on a single MELF? Or is this a terminal-to-terminal short between or than one MELF? * Clearance of 0.8mm is the distance between what features? * Size ME
Electronics Forum | Mon Nov 11 13:46:43 EST 2002 | ksfacinelli
I have a interesting problem. I have a client that would like us to build 15-20 prototypes of a fairly complex design that contains a Enplas OTB-289-0.8 BGA socket. The problem I have is the customer does not have enough sockets and is asking if we
Electronics Forum | Wed Jun 04 13:05:31 EDT 2003 | JoeH
I may have the oppurtunity to purchase a AAT Microjet machine with the Mach II drying capability. I like the theoretical cleaning/drying capability and power consumption advantages this machine could give us. The relative small footprint is also a
Electronics Forum | Mon Aug 16 13:18:46 EDT 2004 | davef
You bet our reponse changes. Q2R: Hard gold thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2R: This is a hard gold spec?? It looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. The gol
Electronics Forum | Wed Sep 08 06:22:51 EDT 2004 | Tore
Hi all, There seems to be a problem with the major component vendors/manufacturer everywhere; to supply lead free dummy/daisy chain components, in particular BGA-devices, within a reasonable time (not a big fan of 8-12 weeks). If they got them at all
Electronics Forum | Mon Apr 11 15:37:29 EDT 2005 | GS
For 1,27 mm Column Pitch, we set our process like this: - Stencil 0,20 mm If allowed also for other SMDs otherways some time 0,150 with step up stencil used only for CCGA area. - paste height min 0,175 mm - aperture 0,75 to 0,8 mm - paste volum
