Electronics Forum: 0603 aperture pitch (Page 7 of 55)

QFN soldering

Electronics Forum | Mon Nov 12 09:22:41 EST 2007 | devajj

BTW, The surrounded QFN fine pitch terminals > should have the normal aperture reduction of 7 % > in case of RoHS Senju solder paste. This works > for our Telecom customer. > > The vias in the > ground pad will be somewhat filled with solder >

SMT Line Test

Electronics Forum | Wed Jan 16 20:08:48 EST 2002 | davef

Comments are: * Some people use calibrated boards and components to remove sources of variation when using their CMM to measure placement accuracy. Sources of supply are listed in the fine SMTnet Archives. * It�s unclear that a single board will mee

Pin in Paste assistance

Electronics Forum | Tue Sep 29 21:39:07 EDT 2020 | kylehunter

Hi, We are currently working on a board that has 3x 50-pin THT at 1.27mm pitch each. This is too small for us to be able to consistently do on our selective solder. We are instead considering pin in paste. The connector we are using can be spec'd at

Aperture Reduction for QFP (fine pitch)

Electronics Forum | Mon Sep 20 20:51:36 EDT 1999 | Greg H.

My stencil thickness is 6 mil and we got qfp's with fine pitch. how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? thanks

SMT Line Test

Electronics Forum | Wed Jan 16 07:49:14 EST 2002 | Yannick

Hi, In few weeks I want to test the capabilities of our SMT Line. To do that I'll design a board. I want to test: - The Printing - The component placement - The soldering - Different stencil aperture - Mixed Technology (Thr

Stencil Thickness

Electronics Forum | Thu Jun 28 09:07:51 EDT 2007 | mika

Laser cut 0.13mm stencil thicknes works great for us. BTW, are we talking RoHS solder paste? We do reduce the stencil apertures to 88 % of the pads when we go for the RoHS solder paste. Otherwise we go fo 96% reduction in general with some excemption

Fine Pitch Printing Issues

Electronics Forum | Thu May 20 15:47:49 EDT 2010 | mikesewell

What is the area ratio for the aperture? What size paste are you using? Stencil thickness & aperture size?

Solder paste amount

Electronics Forum | Tue Jan 16 09:23:26 EST 2001 | P.Gerits

Hello, Standard way to calculate stencil design can be done as follows: A normal ratio of aperture width/stencil thickness = 1.5 for pitches below 650u A normal ratio of stencil aperture width against pad width = 0.8-0.9 (or stencil aperture 10%-20

Re: Aperture sizes for printing SMD adhesive

Electronics Forum | Mon Feb 22 12:04:15 EST 1999 | Dave F

| Please could you suggest a recommended aperture sizes for | printing of smd adhesives. Any recommendations on stencil thickness as well as stencil finish will be appreciated. | Mark: About the only rule of printing adhesives is: Keep it off the

BGA question

Electronics Forum | Wed Feb 09 14:23:41 EST 2005 | russ

First off how thick is your stencil going to be? I have printed .5mm pitch with .009" apertures with a 6 mil stencil. A 5 mil would have been better but the 6 worked just fine. Pitch is not necessarily the deciding factor for paste type. it is the


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