Electronics Forum | Thu Oct 22 14:34:53 EDT 2009 | davef
To find suggestions like: "Go 1:1 on leads and 50% reduction on the body pad. Works every time no matter what QFN," search the fine SMTnet Archives.
Electronics Forum | Fri Aug 27 12:28:34 EDT 2010 | patrickbruneel
Under certain circumstances, Toyota says, solder connections may develop a crack that creates unpredictable behavior in the circuit. Look here: http://www.thecarconnection.com/marty-blog/1048692_toyota-recalls-1-1-mi
Electronics Forum | Wed Dec 08 20:15:25 EST 2010 | davef
What is the solids content of your solder? 50%??? Then, theoretically, if the aperture is 1:1, you'll have 2 thou of solder on your pads.
Electronics Forum | Wed Jan 12 09:42:46 EST 2011 | gantry
Ensure you put it on a PC with Windows 3.1.1. AP was released for that version of windows only, there are some "fixes" out there for newer operating systems but it may produce "buggy" results and it was never supported by Quad.
Electronics Forum | Tue Jun 18 19:37:54 EDT 2013 | emrtech
I have created a program that converts the CAD data to MyData file format that has been working great for me on the my9 and my100 pick and place machines. if interested email me at luie1_1@yahoo.com
Electronics Forum | Mon Sep 23 09:55:12 EDT 2013 | emeto
Hi, just for the package you have you will see 20 different designs for the ground pad. Some will be 1:1 with the part some will be 3 times bigger than the part ground contact. I would always print according to the part and will always do a windowpa
Electronics Forum | Tue May 06 11:26:52 EDT 2014 | aj
Hi all, Can anyone share the necessary info for printing 0201's? stencil Thickness, grade of steel, 1:1 etc Thanks in advance, AJ
Electronics Forum | Sun Aug 09 15:25:17 EDT 2015 | dev88
dear sir i am new for aoi section,my work will be teaching of aoi defect and related to programming, want to know how to make program easily in mirtec 4.1.1 and what are the different standard which we must understand.
Electronics Forum | Tue Apr 12 20:46:50 EDT 2016 | davef
IPC-TM-650 Test Methods Manual, 2.1.1 Subject Microsectioning, Manual and Semi or Automatic Method [ https://www.ipc.org/TM/2-1-01F.pdf ]
Electronics Forum | Mon Apr 16 16:24:20 EDT 2018 | slthomas
Amazingly enough, every one of these held fast where we placed them with a paste brick sized 1:1 with the thermal pad, no sectioning. Yes, there were voids, but we can live with that in this application.
