Electronics Forum | Tue Feb 11 11:42:06 EST 2020 | slthomas
Yep....I just looked at a copy of IPC-610-G and am not 100% sure but I think it's Note 5, Table 8-16, pg. 8-96.
Electronics Forum | Tue Feb 11 13:03:05 EST 2020 | astarotf
Evtimov The areas analyzed are a standard oven curve according to the pasta we are using. The channels used are only for measuring the oven temperature profile, not in detail of the QFN component sector.
Electronics Forum | Tue Feb 11 17:04:43 EST 2020 | astarotf
hello robgd3 Thank you for your contribution based on your experience and I see that it is very useful for my case, since it is very similar, we will begin to analyze the points mentioned.
Electronics Forum | Tue Feb 11 17:05:53 EST 2020 | astarotf
Evtimov thank you very much for sharing this profile, we will perform tests with this curve to see behaviors in the oven and pasta.
Electronics Forum | Wed Feb 19 12:30:19 EST 2020 | emeto
Sebas, Curve you attached is using different temp table. We need valid data to evaluate.
Electronics Forum | Thu Feb 20 07:48:16 EST 2020 | benreben
Hello, The oven profil is not the solution! The only solution for the solder mount on the side is to put gel flux on the side of qfn and make a second travel in reflow . The flux remove oxyde from the copper that is not tinned and the solder is able
Electronics Forum | Sun Feb 23 21:19:08 EST 2020 | sssamw
Yes, this is for tin-lead profile. And for the QFN pins which has copper exposed that not required and not possible to have fillet on side surface as in IPC, see 8.3.13, in IPC-A-610-G
Electronics Forum | Wed Feb 12 14:38:18 EST 2020 | SMTA-Alex
There are several areas you can check. Your profile is very fast. You reach the peak at around 3 minute mark. That's not enough time for the fillet to form. Try to slow down your belt speed to around 90-95, to give it more time. Also, your temperatur
Electronics Forum | Tue Feb 11 11:00:13 EST 2020 | astarotf
hello Evtimov Thanks for your answer. I will analyze the curve with our pasta supplier to reconfirm if it is adequate. It would also be helpful if you could share the tin lead curve profile to analyze. The location of the QFN is assembled by the top
Electronics Forum | Tue Feb 18 06:14:53 EST 2020 | astarotf
Evtimov SMTA-Alex Hi After the comments, we have analyzed our oven curve according to our sheet of technical data of solder paste. We modify the curve taking the linearity to the maximum with what the file specifies, we attach the profile and the c