Electronics Forum | Wed Aug 21 17:03:13 EDT 2013 | hegemon
I think your pre-heat temp is a little low for SAC 305 Soldering. Especially with a Pallet. You might want to try to add some time and temp to get the PWB itself preheated up to 150-160C. That should help with the barrel fill. Make sure your board
Electronics Forum | Thu Apr 17 13:30:30 EDT 2014 | anvil1021
in our opinion unless the Nikon machine has a solution to the Xplane ability to use Tomosynthesis there is a huge difference in the 2 machines. Xplane is a huge quality enabler and we have people beating our door down to get us to look at their perce
Electronics Forum | Thu Jul 30 10:59:05 EDT 2015 | emeto
Hi, I had similar problem on my Dage X-ray machine. I had to reinstall the firmware for the Nextmove card. Check your CDs you have with the machine and you should have a software(and manuals) which you will use to reinstall the firmware on your cont
Electronics Forum | Wed Sep 23 07:51:28 EDT 2015 | kkay
We have been experiencing an issue where our Panasonic film caps on a board are losing their rated capacitance. We are well within their recommended reflow specs and no other operation exposes the part to a temp of more than 160°C. The caps will read
Electronics Forum | Tue May 22 10:01:19 EDT 2018 | jacson_vu
Hi All, Could you share for me inspection spec that you set up for SPI machine ? Which standard you base that? IPC or something like that. So far, my factory set up as below: Area , volume , high are: lower limit is 60%, upper limit 160% for 0201 ch
Electronics Forum | Fri Dec 06 02:31:34 EST 2019 | grimus
Thank you Robi, I tried. Officialy service answered that they are not supporting this machine. So I'm looking for alternative method. Maybe some of you still have this machine, or you know when I can get spare parts (perhaps somewhere in Asia they co
Electronics Forum | Sat Mar 13 13:34:45 EST 2021 | proy
I have an excellent operating X-Ray - Phoenix PCB analyser 160. It seems there was available software for Voiding Calculation but I am not sure if my machine has this - I do know that we have the BGA analysis tool, but have to look in and see if we
Electronics Forum | Thu May 20 15:58:36 EDT 2021 | rsatmech
My product has 2.4Mil and 3.1Mil stencil. For both the stencil my SPI specification is set as 30% to 160% How this is calculated. Can anyone enlight me. Solder Paste type 5. Minimum opening is 0.16*0.18mm in stencil.
Electronics Forum | Fri May 29 17:19:54 EDT 1998 | Earl Moon
| | | | Thanks Steve- | | Here is the whole story: | | | | The solder balls are appearing all over, similar to a | | splatter. They are relatively small. We are using H-Technologies | | S-HQ no-clean solder paste. The stencil is 6 mil and the
Electronics Forum | Mon Jun 01 14:35:59 EDT 1998 | Rich
| | | | | | Thanks Steve- | | | Here is the whole story: | | | | | | The solder balls are appearing all over, similar to a | | | splatter. They are relatively small. We are using H-Technologies | | | S-HQ no-clean solder paste. The stencil is
