Electronics Forum: 18.00 (Page 7 of 14)

MPM UP2000 HI-E S/N 22610

Electronics Forum | Wed Mar 30 18:00:27 EDT 2022 | compit

If you do not find it until Monday - write. I have one, but I won't be at work until Monday, maybe I'll help.

BGA Solder Short

Electronics Forum | Tue Jul 18 00:24:10 EDT 2023 | stephendo

Those photos also look like delamination. The balls are smaller where the bridging is. There isn't more solder. It's that the solder is somehow squeezed together. Check the BGAs after removing to see if they do have a bulge. Maybe the pcb is flexi

BGA Solder Short

Electronics Forum | Tue Jul 18 00:45:17 EDT 2023 | stephendo

You don't have people that are fanatics about vacuum sealing do you? There air should be only lightly evacuated. If done like frozen food is done that can isolate parts in pockets. And actually draw moisture into the bag. And cause holes in corner

Reliability Problem

Electronics Forum | Tue Feb 29 21:18:00 EST 2000 | Gwen Z

When an assemblied board was on active service, what's the main reason for its failure:the package broken; the mechanics fatigue failure under thermal cycle; the corrosion caused by salt and vapor; the broken chip inside the package etc. I think all

Determining value of used SMT equipment

Electronics Forum | Thu Nov 02 18:00:52 EST 2000 | Peter

My company is is the process of outsourcing our SMT operation and we will ne salvaging (selling) our equipment - this is not a solicitation. I am trying to find a source to determine the value of the equipment. Is there an industry source for used v

High Temp measuring device

Electronics Forum | Mon Aug 07 18:00:35 EDT 2000 | Keith

Hi, I'm looking for a kit or design for a high temperature measuring device (thermometer). The necessary feature would include: measures air temp. senses up to 700 degrees c audible alarm max temp memeory setting Any help would be greatly appr

Reliability Problem

Electronics Forum | Tue Feb 29 21:18:00 EST 2000 | Gwen Z

When an assemblied board was on active service, what's the main reason for its failure:the package broken; the mechanics fatigue failure under thermal cycle; the corrosion caused by salt and vapor; the broken chip inside the package etc. I think all

Re: GSM1 FEEDERS

Electronics Forum | Wed Jul 07 16:18:00 EDT 1999 | Thomas Nocpen

| We got plenty of 16mmX12mm GSM1 Tape feeders that are not in use and we are short of 16mmX8mm Tape feeders. | Is there a way to convert these 16mmX12mm into 16mmX8mm ? | | Thanks and Regards, | | I had the same issue and traded them in towards t

Dewetting Problem on Photo-coupler lead

Electronics Forum | Sun Apr 18 00:07:23 EDT 1999 | Vic Lau

I have experienced some dewetting problem on the photo-coupler's lead. No matter what types (how strong) the pre-cleaner and fluxes I used, still not completely resolve this problem. I just wonder, why this is so common to have dewetting problem on

SRT BGA Rework

Electronics Forum | Fri Dec 18 00:49:43 EST 1998 | Mr Mariscal

I have been developing a BGA Process and are having problems with a 310 IO PBGA reflowing. I am achieving good wetting exept 2 to 5 balls on the outer perimeter I have a good profile my air flow is set per mfg spec, the strange thing is that it does


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